參數(shù)資料
型號: IBM42M10LNYAA10
廠商: IBM Microeletronics
英文描述: 1063 MB/S Gigabit Link Module(1063 MB/S 吉位連接模塊(高性能集成光纖收發(fā)器))
中文描述: 1063 MB / s的千兆連接模塊(1063 MB /秒吉位連接模塊(高性能集成光纖收發(fā)器))
文件頁數(shù): 19/26頁
文件大?。?/td> 436K
代理商: IBM42M10LNYAA10
IBM42M10SNYAA20
IBM42M10LNYAA10
1063Mb/s Gigabit Link Module - No OFC
GLM1063N.02
11/10/99
IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
Page 19 of 26
Thermal Characteristics
Air Speed (lfpm)
External Thermal Resistance (R
ext
) (
±
C/W)
Notes
Ser/Des IC Module
161
18.0
1
268
20.9
1
375
25.9
1
Laser Driver/Post Amp IC Module
161
38.7
1
268
43.2
1
375
51.2
1
1. The case temperature can be calculated using the following equation:
CASE
T
ambient
R
ext
ACF
+
=
where
ACF
= Altitude Correction Factor (1 for Sea Level & 1.12 for 4200 ft.) and
Power
= power dissipated in the serializer or
deserializer IC module (calculated from table below).
V
CC
= 4.5V to 5.5V
Reliability Projections
Parameter
Symbol
Min
Typical
Max.
Units
Notes
Average Failure Rate
AFR
0.0195
%/khr
1
1. AFR specified over 44 khours. To meet the specified AFR, the case temperatures of the serializer and deserializer IC modules
should not exceed 85
±
C. In addition, the case temperature of the laser should not exceed 50
±
C.
Power
IC Module
Typical
Max
Serializer/Des.
0.92W
1.32W
Laser Driver/Post Amp
0.65W
0.84W
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