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參數(shù)資料

型號：	IBM25PPC750GXEAB5H43T
元件分類：	微控制器/微處理器
英文描述：	32-BIT, 933 MHz, RISC PROCESSOR, CBGA292
封裝：	21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
文件頁數(shù)：	45/74頁
文件大?。?/td>	1054K
代理商：	IBM25PPC750GXEAB5H43T

Datasheet

IBM PowerPC 750GX RISC Microprocessor

DD1.X

750GX_dsLOF.fm SA14-2765-02

September 2, 2005

List of Figures

Page 5 of 73

List of Figures

Figure 2-1.

IBM PowerPC 750GX RISC Microprocessor Block Diagram ................................................. 13

Figure 3-1.

SYSCLK Input Timing Diagram .............................................................................................. 18

Figure 3-2.

Linear Sweep Modulation Profile ........................................................................................... 19

Figure 3-3.

Input Timing Definition ........................................................................................................... 21

Figure 3-4.

Input Timing Diagram ............................................................................................................. 21

Figure 3-5.

Mode Select Input Timing Diagram ........................................................................................ 22

Figure 3-6.

Output Valid Timing Definition ................................................................................................ 24

Figure 3-7.

Output Timing Diagram for IBM PowerPC 750GX RISC Microprocessor .............................. 25

Figure 3-8.

JTAG Clock Input Timing Diagram ......................................................................................... 27

Figure 3-9.

TRST Timing Diagram ........................................................................................................... 27

Figure 3-10. Boundary-Scan Timing Diagram ............................................................................................ 27

Figure 3-11. Test Access Port Timing Diagram .......................................................................................... 28

Figure 4-1.

Mechanical Dimensions, Standard Package .......................................................................... 31

Figure 4-2.

Mechanical Dimensions, ROHS-Compatible Package .......................................................... 33

Figure 4-3.

Module Substrate Decoupling Voltage Assignments ............................................................. 35

Figure 4-4.

PowerPC 750GX Microprocessor Ball Placement ................................................................. 36

Figure 5-1.

Single PLL Power Supply Filter Circuit with A1VDD Pin and A2VDD Pin Tied to GND ......... 51

Figure 5-2.

PLL Power Supply Filter Circuit with Two AVDD Pins and One Ferrite Bead ........................ 51

Figure 5-3.

Dual PLL Power Supply Filter Circuits ................................................................................... 52

Figure 5-4.

Orientation and Layout of the 750GX Decoupling Capacitors ............................................... 54

Figure 5-5.

Driver Impedance Measurement ............................................................................................ 55

Figure 5-6.

IBM RISCWatch JTAG to HRESET, TRST, and SRESET Signal Connector ........................ 61

Figure 5-7.

Package Exploded Cross-Sectional View with Several Heat-Sink Options ........................... 62

Figure 5-8.

C4 Package with Heat Sink Mounted to a Printed-Circuit Board ........................................... 65

Figure 5-9.

Thermal Performance of Select Thermal Interface Material .................................................. 66

Figure 5-10. Example of a Pin-Fin Heat-Sink-to-Ambient Thermal Resistance versus Airflow Velocity .... 68

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相關(guān)代理商/技術(shù)參數(shù)	參數(shù)描述
IBM25PPC750GXEBB2562T	制造商:IBM 功能描述:
IBM25PPC750GXEBB2563T	制造商:IBM 功能描述:
IBM25PPC750GXECB2563T	制造商:IBM 功能描述:
IBM25PPC750GXECB2H33T	制造商:IBM 功能描述:
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