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參數(shù)資料

型號(hào)：	IBM25PPC750FX-GB0123T
元件分類：	微控制器/微處理器
英文描述：	32-BIT, 600 MHz, RISC PROCESSOR, CBGA292
封裝：	21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
文件頁數(shù)：	23/62頁
文件大小：	452K
代理商：	IBM25PPC750FX-GB0123T

Datasheet

DD 2.X

Preliminary

PowerPC 750FX RISC Microprocessor

750FX_DS_DD2.X_V2.02.fm.2.0

June 9, 2003

Page 1 of 63

1. General Information .................................................................................................... 3

1.1 Features ............................................................................................................................................ 3

1.2 Design Level Considerations and Features ...................................................................................... 5

1.3 Processor Version Register .............................................................................................................. 5

1.4 Part Number Information ................................................................................................................... 6

2. Overview ...................................................................................................................... 7

2.1 Block Diagram ................................................................................................................................... 7

2.2 General Parameters .......................................................................................................................... 8

3. Electrical and Thermal Characteristics ..................................................................... 9

3.1 DC Electrical Characteristics ............................................................................................................. 9

3.2 Clock AC Specifications .................................................................................................................. 13

3.3 Spread Spectrum Clock Generator (SSCG) ................................................................................... 14

3.5 60x Bus Output AC Specifications .................................................................................................. 17

3.6 Alternate I/O Timing For 3.3V Bus .................................................................................................. 19

3.6.1 IEEE 1149.1 AC Timing Specifications ................................................................................. 20

4. Dimensions and Signal Assignments ..................................................................... 22

4.1 Module Substrate Decoupling Voltage Assignments ...................................................................... 22

4.2 Package .......................................................................................................................................... 22

4.3 Microprocessor Ball Placement ....................................................................................................... 24

5. System Design Information ..................................................................................... 31

5.1 PLL Considerations ......................................................................................................................... 31

5.1.1 Restrictions and Considerations for PLL Configuration ......................................................... 32

5.1.1.1 Configuration Restriction on Frequency Transitions ...................................................... 32

5.1.2 PLL_RNG[0:1] Definitions for Dual PLL Operation ................................................................ 32

5.1.3 PLL Configuration .................................................................................................................. 33

5.2 PLL Power Supply Filtering ............................................................................................................. 35

5.3 Decoupling Recommendations ....................................................................................................... 39

5.4 Output Buffer DC Impedance .......................................................................................................... 42

5.4.1 Input-Output Usage ............................................................................................................... 43

5.5 Level Protection .............................................................................................................................. 48

5.6 64 or 32-Bit Data Bus Mode ............................................................................................................ 49

5.7 IIO Voltage Mode Selection ............................................................................................................ 49

5.8 Thermal Management ..................................................................................................................... 49

5.8.1 Heat Sink Selection Example ................................................................................................ 49

5.8.2 Internal Package Conduction ................................................................................................ 52

5.8.3 Minimum Heat Sink Requirements ........................................................................................ 53

5.8.4 Heat Sink Mounting ............................................................................................................... 54

5.8.5 Thermal Assist Unit ............................................................................................................... 54

5.8.6 Adhesives and Thermal Interface Materials .......................................................................... 55

5.8.7 Thermal Interface and Adhesive Vendors ............................................................................. 56

5.8.8 Heat Sink Vendors ................................................................................................................. 57

Revision Log ................................................................................................................ 59

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相關(guān)代理商/技術(shù)參數(shù)	參數(shù)描述
IBM25PPC750FX-GB0132T	制造商:IC'S/TRANSISTORS/DIO 功能描述: 制造商:IC'S/TRANSISTORS/DIODES 功能描述:
IBM25PPC750FX-GB0132V	制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays
IBM25PPC750FX-GB0133V	制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays
IBM25PPC750FX-GB0532V	制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays
IBM25PPC750FX-GB0533V	制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays

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