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參數(shù)資料
| 型號： | IBM25PPC750CXEJQ4012T |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 466 MHz, RISC PROCESSOR, PBGA256 |
| 封裝： | 27 X 27 MM, LEAD FREE, PLASTIC, BGA-256 |
| 文件頁數(shù)： | 35/44頁 |
| 文件大小： | 416K |
| 代理商： | IBM25PPC750CXEJQ4012T |
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Data Sheet
PowerPC 750CXe RISC Microprocessor
Preliminary
System Design Information
Page 32 of 36
750cxe_DD3.1_Dev_3_gen_mkt.fm.1.5
April 8, 2004
6.6 Thermal Management Information
This section provides thermal management information for the PBGA package for air cooled applications.
Proper thermal control design is primarily dependent upon the system-level design and air flow.
6.6.1 Thermal Assist Unit
The thermal sensor in the Thermal Assist Unit (TAU) has not been characterized to determine the basic
uncalibrated accuracy. The relationship between the actual junction temperature and the temperature
indicated by THRM1 and THRM2 is not well known.
IBM recommends calibration of the TAU in these devices before use. Calibration methods are discussed in
the IBM Application Note Calibrating the Thermal Assist Unit in the IBM25PPC750L Processors. Although
this note was written for the 750L, the calibration methods discussed in this document also apply to the
750CXe.
6.6.2 Heat Sink Considerations
The PowerPC 750CXe package will support a maximum normal load of 2.2kg. This load includes the heat
sink and any forces used to position or fasten the heat sink.
Figure 6-3. IBM RISCWatch JTAG to HRESET, TRST, and SRESET Signal Connector
HRESET from RISCWatch
System HRESET
HRESET to 750CX
TRST to 750CX
SRESET to 750CX
SRESET from RISCWatch
System SRESET
TRST from RISCWatch
Note: See notes for Table 6-3 on page 30.
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