- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄67682 > IBM25PPC405GPR3DB266 32-BIT, 266 MHz, RISC PROCESSOR, PBGA456 PDF資料下載
參數(shù)資料
| 型號： | IBM25PPC405GPR3DB266 |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA456 |
| 封裝： | 27 X 27 MM, ENHANCED, PLASTIC, BGA-456 |
| 文件頁數(shù)： | 32/58頁 |
| 文件大?。?/td> | 1264K |
| 代理商： | IBM25PPC405GPR3DB266 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁當(dāng)前第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁
Preliminary
PowerPC 405GPr Embedded Processor Data Sheet
Page 38 of 58
3/14/03
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device
Characteristic
Symbol
Value
Unit
Supply Voltage (Internal Logic)
VDD
0 to +1.95
V
Supply Voltage (I/O Interface)
OVDD
0 to +3.6
V
PLL Supply Voltage
AVDD
0 to +1.95
V
Input Voltage (1.8 V CMOS receivers)
VIN
-0.6 to VDD + 0.45
V
Input Voltage (3.3 V LVTTL receivers)
VIN
-0.6 to OVDD + 0.6
V
Input Voltage (5.0 V LVTTL receivers)
VIN
-0.6 to OVDD + 2.4
V
Storage Temperature Range
TSTG
-55 to +150
°C
Case temperature under bias
TC
-40 to +120
°C
Note: All specified voltages are with respect to GND.
Package Thermal Specifications
The PPC405GPr is designed to operate within a case temperature range of -40°C to +85°C. Thermal resistance values
for the E-PBGA packages in a convection environment are as follows:
Package—Thermal Resistance
Symbol
Airflow
ft/min (m/sec)
Unit
0 (0)
100 (0.51)
200 (1.02)
35 mm, 456-balls—Junction-to-Case
θ
JC
222
°C/W
35mm, 456-balls—Case-to-Ambient1
θ
CA
14
13
12
°C/W
27 mm, 456-balls—Junction-to-Case
θ
JC
222
°C/W
27mm, 456-balls—Case-to-Ambient1
θ
CA
18
16
15
°C/W
Note:
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
b. TA = TC – P×θCA, where TA is ambient temperature and P is power consumption.
c. TCMax = TJMax – P
×θ
JC, where TJMax is maximum junction temperature and P is power consumption.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IBM25PPC603E-BX-133X | 32-BIT, 133 MHz, RISC PROCESSOR, CBGA255 |
| IBM25PPC603EV-FX-233X | 32-BIT, 233 MHz, RISC PROCESSOR, CQFP240 |
| IBM25PPC603EV-FX-225X | 32-BIT, 225 MHz, RISC PROCESSOR, CQFP240 |
| IBM25PPC603EV-BX-233X | 32-BIT, 233 MHz, RISC PROCESSOR, CBGA255 |
| IBM25PPC603EV-BX-225X | 32-BIT, 225 MHz, RISC PROCESSOR, CBGA255 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IBM25PPC405-GPR-3JB266Z | 制造商:IBM 功能描述: |
| IBM25PPC405GPR-3KB266C | 制造商:IBM 功能描述: |
| IBM25PPC440GX3CB667C | 制造商:IBM 功能描述: |
| IBM25PPC603E-BX-080-X | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| IBM25PPC603E-BX-100-X | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。