參數(shù)資料
型號(hào)： IBM25PPC405GP-3DD200C
元件分類： 微控制器/微處理器
英文描述： RISC PROCESSOR, PBGA456
封裝： 27 MM, PLASTIC, BGA-456
文件頁數(shù)： 40/58頁
文件大?。?/td> 878K
代理商： IBM25PPC405GP-3DD200C
PowerPC 405GP Embedded Processor Data Sheet
45
Notes:
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
b. TA = TC – P×θCA, where TA is ambient temperature and P is power consumption.
c. TCMax = TJMax – P
×θ
JC, where TJMax is maximum junction temperature and P is power consumption.
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device
Characteristic
Symbol
Value
Unit
Supply Voltage (Internal Logic)
VDD
0 to 2.71
V
Supply Voltage (I/O Interface)
OVDD
0 to 3.61
V
PLL Supply Voltage
AVDD
0 to 2.7
V
Input Voltage (3.3V LVTTL receivers)
VIN
0 to 3.6
V
Input Voltage (5.0V LVTTL receivers)
VIN
0 to 5.5
V
Storage Temperature Range
TSTG
-55 to 150
°C
Case temperature under bias
TC
-40 to +120
°C
Notes:
1. If OVDD ≥ 0.4V it is required that VDD ≥ 0.4V. Supply excursions not meeting this criteria must be limited to less than 25ms dura-
tion during each power up or power down event.
Package Thermal Specications
The PPC405GP is designed to operate within a case temperature range of -40C to 120C. Thermal resistance values for
the E-PBGA packages in a convection environment are as follows:
Package—Thermal Resistance
Symbol
Airow
ft/min (m/sec)
Unit
0 (0)
100 (0.51)
200 (1.02)
35mm, 456-balls—Junction-to-Case
θ
JC
2
°C/W
35mm, 456-balls—Case-to-Ambient1
θ
CA
14
13
12
°C/W
27mm, 456-balls—Junction-to-Case
θ
JC
2
°C/W
27mm, 456-balls—Case-to-Ambient1
θ
CA
18
16
15
°C/W
25mm, 413-balls—Junction-to-Case
θ
JC
1.5
°C/W
25mm, 413-balls—Case-to-Ambient1
θ
CA
17
15
13
°C/W
相關(guān)PDF資料
PDF描述
IBM25PPC405GP-3BD266C RISC PROCESSOR, PBGA456
IBM25PPC405GP3EE200CZ 32-BIT, 200 MHz, RISC PROCESSOR, PBGA413
IBM25PPC405GP-3BE200C 32-BIT, 200 MHz, RISC PROCESSOR, PBGA456
IBM25PPC405GP-3EE266C 32-BIT, 266.66 MHz, RISC PROCESSOR, PBGA413
IBM25PPC405GP-3DE266CZ 32-BIT, 266.66 MHz, RISC PROCESSOR, PBGA456
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IBM25PPC405GP-3DE200C 制造商:IBM 功能描述:Microprocessor, 32 Bit, 456 Pin, Plastic, BGA
IBM25PPC405GP3DE200CZ 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|456PIN|PLASTIC
IBM25PPC405GP-3DE266C 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|456PIN|PLASTIC
IBM25PPC405GP3DE266CZ 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|456PIN|PLASTIC
IBM25PPC405GP-3EE200C 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|413PIN|PLASTIC
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