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參數(shù)資料
| 型號： | IBM13T4644MPD |
| 廠商： | IBM Microeletronics |
| 英文描述： | One Bank 4M x 64 SDRAM SO DIMM（Small Outline Dual In-line Memory Module）(1組 4M x 64 PC100小外形雙列直插同步動態(tài)RAM模塊) |
| 中文描述： | 一位銀行分蘇× 64 SDRAM的內(nèi)存（小外形雙列直插內(nèi)存模塊）（1組4米× 64 PC100的小外形雙列直插同步動態(tài)內(nèi)存模塊） |
| 文件頁數(shù)： | 1/18頁 |
| 文件大小： | 271K |
| 代理商： | IBM13T4644MPD |
IBM13T4644MPE
IBM13T4644MPD
One Bank 4M x 64 SDRAM SO DIMM
45L7126.E93903A
5/99
IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
Page 1 of 18
Features
144 Pin (emerging) JEDEC Standard, 8 Byte
Small Outline Dual-In-line Memory Module
4Mx64 Synchronous DRAM SO DIMM
Performance:
Inputs and outputs are LVTTL (3.3V) compatible
Single 3.3V
±
0.3V Power Supply
Single Pulsed RAS interface
SDRAMs have four internal banks
Fully Synchronous to positive Clock Edge
Data Mask for Byte Read/Write control
Programmable Operation:
- CAS Latency: 2, 3
- Burst Type: Sequential or Interleave
- Burst Length: 1, 2, 4, 8, Full-Page (Full-
Page supports Sequential burst only)
- Operation: Burst Read and Write or Multiple
Burst Read with Single Write
Auto Refresh (CBR) and Self Refresh
Automatic and controlled Precharge Commands
Suspend Mode and Power Down Mode
12/8/2 Addressing (Row/Column/Bank)
4096 refresh cycles distributed across 64ms
Serial Presence Detect
Card size: 2.66"x1.0"x0.149"IBM13T4644MPD
Card size: 2.66"x1.15"x0.149"IBM13T4644MPE
Gold contacts
SDRAMS in TSOP Type II Package
Description
IBM13T4644MPD is a 144-pin Synchronous DRAM
Small Outline Dual In-line Memory Module (SO
DIMM) which is organized as a 4Mx64 high-speed
memory array. The SO DIMM uses four 4Mx16
SDRAMs in 400mil TSOP II packages and achieves
high speed data transfer rates of up to 100MHz by
employing a prefetch/pipeline hybrid architecture
that supports the JEDEC 1N rule while allowing very
low burst power. The SO DIMM is intended to com-
ply with all JEDEC standards set for 144 pin
SDRAM SO DIMMs.
All control, address, and data input/output circuits
are synchronized with the positive edge of the exter-
nally supplied clock inputs. All inputs are sampled at
the positive edge of the externally supplied clock
(CK0). Internal operating modes are defined by
combinations of the RAS, CAS, WE, S0, DQMB,
and CKE0 signals. A command decoder initiates the
necessary timings for each operation. A 14 bit
address bus accepts address information in a
row/column multiplexing arrangement.
Prior to any access operation, the CAS latency,
burst type, burst length, and burst operation type
must be programmed into the SO DIMM by address
inputs A0-A9 during the mode register set cycle.
The SO DIMM uses serial presence detects imple-
mented via a serial EEPROM using the two pin IIC
protocol. The first 128 bytes of serial PD data are
used by the DIMM manufacturer. The last 128 bytes
are available to the customer.
All IBM 144-pin SO DIMMs provide a high perfor-
mance, flexible 8-byte interface in a 2.66" long
space-saving footprint.
-10
3
Units
CAS Latency
f
CK
t
CK
t
AC
Clock Frequency
100
MHz
Clock Cycle
10
ns
Clock Access Time
7
ns
Card Outline
1
2
143
144
(Front)
(Back)
59
60
61
62
.
Discontinued (4/1/00 last order; 7/31/00 - last ship)
相關(guān)PDF資料 |
PDF描述 |
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| IBM13T4644MPE | 4M x 64 PC100 SDRAM SO DIMM（Small Outline Dual In-line Memory Module）(4M x 64 PC100小外形雙列直插式同步動態(tài)RAM模塊) |
| IBM13T8644HPB | 8M x 64 SDRAM SO DIMM（Small Outline Dual In-line Memory Modules）(8M x 64 144腳小外形雙列直插同步動態(tài)RAM模塊) |
| IBM13T8644HPC | 8M x 64 SDRAM SO DIMM（Small Outline Dual In-line Memory Modules）(8M x 64 144腳小外形雙列直插同步動態(tài)RAM模塊) |
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| IBM13T8644HPE | One Bank 8M x 64 SDRAM SO DIMM（Small Outline Dual In-line Memory Module）(1組 8M x 64 PC100小外形雙列直插式同步動態(tài)RAM模塊) |
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