參數(shù)資料
型號(hào): HYB 3116405BJ-50
廠商: SIEMENS AG
英文描述: 4M×4-Bit Dynamic RAM(4k-Refresh,Hyper Page Mode - EDO)(4M×4位 動(dòng)態(tài) RAM (4K刷新,超級(jí)頁(yè)面EDO))
中文描述: 4米× 4位動(dòng)態(tài)隨機(jī)存儲(chǔ)器(4K的刷新,超頁(yè)模式-江戶)(4米× 4位動(dòng)態(tài)隨機(jī)存儲(chǔ)器(4K的刷新,超級(jí)頁(yè)面EDO公司))
文件頁(yè)數(shù): 12/28頁(yè)
文件大?。?/td> 143K
代理商: HYB 3116405BJ-50
HYB 5116(7)405BJ-50/-60
HYB 3116(7)405BJ/BT(L)-50/-60
4M
×
4 EDO-DRAM
Semiconductor Group
12
1998-10-01
Notes
1. All voltages are referenced to
V
SS
.
2.
I
CC1
,
I
CC3
,
I
CC4
and
I
CC6
depend on cycle rate.
3.
I
CC1
and
I
CC4
depend on output loading. Specified values are obtained with the output open.
4. Address can be changed once or less while RAS =
V
IL
. In case of
I
CC4
it can be changed once
or less during a hyper page mode (EDO) cycle
5. An initial pause of 200
μ
s is required after power-up followed by 8 RAS cycles of which at least
one cycle has to be a refresh cycle, before proper device operation is achieved. In case of using
the internal refresh counter, a minimum of 8 CAS-before-RAS initialization cycles instead of
8 RAS cycles are required.
6. AC measurements assume
t
T
= 2 ns.
7.
V
IH (MIN.)
and
V
IL (MAX.)
are reference levels for measuring timing of input signals. Transition times
are also measured between
V
IH
and
V
IL
.
8. Measured with the specified current load and 100 pF at
V
OL
= 0.8 V and
V
OH
= 2.0 V. Access
time is determined by the latter of
t
RAC
,
t
CAC
,
t
AA
,
t
CPA
,
t
OEA
.
t
CAC
is measured from tristate.
9. Operation within the
t
RCD (MAX.)
limit ensures that
t
RAC (MAX.)
can be met.
t
RCD (MAX.)
is specified as
a reference point only. If
t
RCD
is greater than the specified
t
RCD (MAX.)
limit, then access time is
controlled by
t
CAC
.
10.Operation within the
t
RAD (MAX.)
limit ensures that
t
RAC (MAX.)
can be met.
t
RAD (MAX.)
is specified as
a reference point only. If
t
RAD
is greater than the specified
t
RAD (MAX.)
limit, then access time is
controlled by
t
AA
.
11.Either
t
RCH
or
t
RRH
must be satisfied for a read cycle.
12.
t
OFF (MAX.)
,
t
OEZ (MAX.)
define the time at which the output achieves the open-circuit conditions and
are not referenced to output voltage levels.
t
OFF
is referenced from the rising edge of RAS or
CAS, whichever occurs last.
13.Either
t
DZC
or
t
DZO
must be satisfied.
14.Either
t
CDD
or
t
ODD
must be satisfied.
15.
t
WCS
,
t
RWD
,
t
CWD
and
t
AWD
are not restrictive operating parameters. They are included in the data
sheet as electrical characteristics only. If
t
WCS
>
t
WCS (MIN.)
, the cycle is an early write cycle and
data out pin will remain open-circuit (high impedance) through the entire cycle; if
t
RWD
>
t
RWD (MIN.)
,
t
CWD
>
t
CWD (MIN.)
and
t
AWD
>
t
AWD (MIN.)
, the cycle is a read-write cycle and I/O will
contain data read from the selected cells. If neither of the above sets of conditions is satisfied, the
condition of I/O (at access time) is indeterminate.
16.These parameters are referenced to the CAS leading edge in early write cycles and to the WE
leading edge in read-write cycles.
17.When using Self Refresh mode, the following refresh operations must be performed to ensure
proper DRAM operation:
If row addresses are being refreshed on an evenly distributed manner over the refresh interval
using CBR refresh cycles, then only one CBR cycle must be performed immediately after exit
from Self Refresh.
If row addresses are being refreshed in any other manner (ROR - Distributed/Burst; or CBR-
Burst) over the refresh interval, then a full set of row refreshes must be performed immediately
before entry to and immediately after exit from Self Refresh.
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