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參數(shù)資料
| 型號： | HSP43216VC-52Z |
| 廠商： | Intersil |
| 文件頁數(shù)： | 11/20頁 |
| 文件大小： | 0K |
| 描述： | IC HALFBAND FILTER 100-MQFP |
| 標(biāo)準(zhǔn)包裝： | 66 |
| 濾波器類型： | 半帶 |
| 濾波器數(shù)： | 4 |
| 電源電壓： | 4.75 V ~ 5.25 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 100-BQFP |
| 供應(yīng)商設(shè)備封裝： | 100-MQFP（14x20） |
| 包裝： | 托盤 |
19
FN3365.10
October 6, 2008
HSP43216
Plastic Leaded Chip Carrier Packages (PLCC)
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions are
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane
contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
-C-
A1
A
SEATING
PLANE
0.020 (0.51)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.045 (1.14)
R
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
CL
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
CL
N84.1.15 (JEDEC MS-018AF ISSUE A)
84 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.165
0.180
4.20
4.57
-
A1
0.090
0.120
2.29
3.04
-
D
1.185
1.195
30.10
30.35
-
D1
1.150
1.158
29.21
29.41
3
D2
0.541
0.569
13.75
14.45
4, 5
E
1.185
1.195
30.10
30.35
-
E1
1.150
1.158
29.21
29.41
3
E2
0.541
0.569
13.75
14.45
4, 5
N84
84
6
Rev. 2 11/97
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