參數(shù)資料
型號: HSMS-2810-BLK
英文描述: Surface Mount RF Schottky Barrier Diodes
中文描述: 表面貼裝射頻肖特基二極管
文件頁數(shù): 2/10頁
文件大?。?/td> 144K
代理商: HSMS-2810-BLK
2
Electrical Specifications T
C
= 25
°
C, Single Diode
[4]
Maximum
Forward
Voltage
V
F
(V) @
I
F
(mA)
Maximum
Reverse
Leakage
I
R
(nA) @ Capacitance Resistance
V
R
(V)
C
T
(pF)
Minimum
Breakdown
Voltage
V
BR
(V)
Maximum
Forward
Voltage
V
F
(mV)
Typical
Dynamic
Part
Number
HSMS
[5]
Package
Marking
Code
Maximum
Lead
Code
Configuration
R
D
(
)
[6]
2810
2812
2813
2814
2815
2817
2818
281B
281C
281E
281F
281K
B0
[3]
B2
[3]
B3
[3]
B4
[3]
B5
[3]
B7
[3]
B8
[3]
B0
[7]
B2
[7]
B3
[7]
B4
[7]
BK
[7]
0
2
3
4
5
7
8
B
C
E
F
K
Single
Series
Common Anode
Common Cathode
Unconnected Pair
Ring Quad
[5]
Bridge Quad
[5]
Single
Series
Common Anode
Common Cathode
High Isolation
Unconnected Pair
Unconnected Trio
20
400
1.0
35
200
15
1.2
15
281L
BL
[7]
L
Test Conditions
I
R
= 10
μ
A
I
F
= 1 mA
V
F
= 0 V
f = 1 MHz
I
F
= 5 mA
Notes:
1.
V
F
for diodes in pairs and quads in 15 mV maximum at 1 mA.
2.
C
TO
for diodes in pairs and quads is 0.2 pF maximum.
3. Package marking code is in white.
4. Effective Carrier Lifetime (
τ
) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
5. See section titled
Quad Capacitance.
6. R
D
= R
S
+ 5.2
at 25
°
C and I
f
= 5 mA.
7. Package marking code is laser marked.
Absolute Maximum Ratings
[1]
T
C
= 25
°
C
Symbol
Parameter
I
f
Forward Current (1
μ
s Pulse)
P
IV
Peak Inverse Voltage
T
j
Junction Temperature
T
stg
Storage Temperature
θ
jc
Thermal Resistance
[2]
Unit
Amp
V
°
C
°
C
°
C/W
SOT-23/SOT-143
1
Same as V
BR
150
-65 to 150
500
SOT-323/SOT-363
1
Same as V
BR
150
-65 to 150
150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. T
C
= +25
°
C, where T
C
is defined to be the temperature at the package pins where contact is made to the circuit board.
ESD WARNING:
Handling Precautions Should Be Taken To Avoid Static Discharge.
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