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參數(shù)資料
| 型號： | HS1-82C08RH |
| 廠商： | HARRIS SEMICONDUCTOR |
| 元件分類： | 通用總線功能 |
| 英文描述： | Radiation Hardened 8-Bit Bus Transceiver |
| 中文描述： | OCTAL LINE TRANSCEIVER, CDIP20 |
| 文件頁數(shù)： | 3/6頁 |
| 文件大小： | 44K |
| 代理商： | HS1-82C08RH |
3
Specifications HS-82C08RH
Absolute Maximum Ratings
Reliability Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+7.0V
Input, Output or I/O Voltage . . . . . . . . . . . . GND-0.3V to VDD+0.3V
Storage Temperature Range . . . . . . . . . . . . . . . . . -65
o
C to +150
o
C
Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175
o
C
Lead Temperature (Soldering 10s). . . . . . . . . . . . . . . . . . . . +300
o
C
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Thermal Resistance
20 Lead SBDIP Package. . . . . . . . . . . . .
20 Lead Ceramic Flatpack Package . . . .
Maximum Package Power Dissipation at +125
o
C Ambient
20 Lead SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . 0.70W
20 Lead Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . 0.59W
If device power exceeds package dissipation capability, provide heat
sinking or derate linearly at the following rate:
20 Lead SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . .14.1mW/C
20 Lead Ceramic Flatpack Package . . . . . . . . . . . . . . .11.8mW/C
θ
JA
θ
JC
71
o
C/W
85
o
C/W
17
o
C/W
25
o
C/W
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Operating Conditions
Operating Voltage Range. . . . . . . . . . . . . . . . . . . +4.75V to +5.25V
Operating Temperature Range. . . . . . . . . . . . . . . . -55
o
C to +125
o
C
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +1V
Input High Voltage. . . . . . . . . . . . . . . . . . . . . . . . . .VDD -1V to VDD
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
All Devices Guaranteed at Worst Case Limits and Conditions.
PARAMETER
SYMBOL
CONDITIONS
GROUP A
SUBGROUPS
TEMPERATURE
LIMITS
UNITS
MIN
MAX
Input Leakage Current
IIL
VDD = 5.25V, VIN = VDD
Pin Under Test = 0V
1, 2, 3
-55
o
C, +25
o
C,
+125
o
C
-1.0
-
μ
A
IIH
VDD = 5.25V, VIN = 0V
Pin Under Test = 5.25V
1, 2, 3
-55
o
C, +25
o
C,
+125
o
C
-
1.0
μ
A
High Level Output
Voltage
VOH
VDD = 4.75V, IOH = -2.0mA
1, 2, 3
-55
o
C, +25
o
C,
+125
o
C
4.25
-
V
Low Level Output
Voltage
VOL
VDD = 5.25V, IOL = 2.0mA
1, 2, 3
-55
o
C, +25
o
C,
+125
o
C
-
0.5
V
Static Current
SIDD
VDD = 5.25V, VIN = GND
1, 2, 3
-55
o
C, +25
o
C,
+125
o
C
-
100
μ
A
Functional Test
FT
VDD = 4.75V to 5.25V
VIH = VDD -1.0V, VIL = 1.0V
7, 8A, 8B
-55
o
C, +25
o
C,
+125
o
C
-
-
-
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
SYMBOL
GROUP A
SUBGROUPS
TEMPERATURE
LIMITS
UNITS
MIN
MAX
PORT DATA/MODE SPECIFICATIONS
Propagation Delay to Logical “1” from Port
A, B to Port B, A
TPDLH
9, 10, 11
-55
o
C, +25
o
C, +125
o
C
-
65
ns
Propagation Delay to Logical “0” from Port
A, B to Port B, A
TPDHL
9, 10, 11
-55
o
C, +25
o
C, +125
o
C
-
80
ns
Propagation Delay from High-Impedance
to Logical “1” from T/R to Port
TPRTH
9, 10, 11
-55
o
C, +25
o
C, +125
o
C
-
75
ns
Propagation Delay from High-Impedance
to Logical “0” from T/R to Port
TPRTL
9, 10, 11
-55
o
C, +25
o
C, +125
o
C
-
130
ns
Propagation Delay from High-Impedance
to Logical “1” from OE to Port
TPZH
9, 10, 11
-55
o
C, +25
o
C, +125
o
C
-
70
ns
Propagation Delay from High-Impedance
to Logical “0” from OE to Port
TPZL
9, 10, 11
-55
o
C, +25
o
C, +125
o
C
-
130
ns
Spec Number
518057
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