參數(shù)資料
型號： HMMC-5021
元件分類： 放大器
英文描述： 2000 MHz - 22000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封裝： 0.1173 X 0.0303 INCH, DIE
文件頁數(shù)： 4/6頁
文件大?。?/td> 113K
代理商： HMMC-5021
4
Figure 2. HMMC-5021/26 Bonding Pad Locations.
Figure 3. HMMC-5021/26 Assembly Diagram. (For 2.0 – 26.5 GHz Operation)
Note:
Total offset between RF input
and RF output pad is 335
m
(13.2 mils).
VDD
(VDD and Aux Drain Pads)
(VG2 Pad)
(RF Input Pad)
Aux.
Drain
RF
Input
85
80
Chip ID No.
Temp. Diode Sense
Aux. Gate
Temp.
Diode Force
VG1
VG2
RF
Output
225
770
(
±10 m)
300
80
560
(RF Output Pad)
75
270
1695
695
2980 (
± 10 m)
80
490
200
Notes:
All dimensions in microns.
Rectangular Pad Dim: 75 x 75
m.
Octagonal Pad Dim: 90
m dia.
All other dimensions
±5 m
(unless otherwise noted).
Chip thickness: 127
± 15 m.
VDD
VG1
OUT
IN
1.5 mil dia.Gold Wire
Bond to
≥15 nF
DC Feedthru
≥4 nH Inductor
(0.7 mil Gold Wire Bond
with length
≥150 mils)
0.7 mil dia. Gold Bond Wire
(Length NOT important)
Gold Plated Shim
≥68 pF Capacitor
Input and Output Thin Film
Circuit with
≥8 pF
DC Blocking Capacitor
2.0 mil
nom. gap
2.0 mil
nom. gap
Trace Offset
168
m
(6.6 mils)
1.5 mil dia.Gold Wire
Bond to
≥15 nF DC Feedthru
Bonding Island
Trace Offset
168
m
(6.6 mils)
相關(guān)PDF資料
PDF描述
HMMC-5026 2000 MHz - 26500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
HMMC-5023 21200 MHz - 26500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
HMMC-5025 2000 MHz - 50000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
HMMC-5025 2000 MHz - 50000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
HMMC-5026 2000 MHz - 26500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HMMC-5022 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GP AMP 22GHZ 8V CHIP - Gel-pak, waffle pack, wafer, diced wafer on film 制造商:Agilent Technologies 功能描述:ML-GAAS ATTEN CHIP
HMMC-5023 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GP AMP 26.5GHZ 7V - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-5025 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GP AMP 50GHZ 7V - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-5026 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GP AMP 26.5GHZ 8V - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-5027 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL PWR AMP 26.5GHZ 8V CHIP - Gel-pak, waffle pack, wafer, diced wafer on film
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