參數(shù)資料
型號(hào): HK16083N9S-T
廠商: TAIYO YUDEN CO LTD
元件分類: 通用定值電感
英文描述: 1 ELEMENT, 0.0039 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
封裝: CHIP, 1608
文件頁(yè)數(shù): 5/19頁(yè)
文件大小: 1023K
代理商: HK16083N9S-T
PRECAUTIONS
FERRITE
PRODUCTS
5
255
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
Type
1608
2125
3216
L
1.6
2.0
3.2
W
0.8
1.25
1.6
A
0.8 1.0
1.0 1.4
1.8 2.5
B
0.5 0.8
0.8 1.5
0.8 1.7
C
0.6 0.8
0.9 1.2
1.2 1.6
1/7
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
1. Circuit Design
Verication of operating environment, electrical rating
and performance
1. A malfunction in medical equipment, spacecraft, nucle-
ar reactors, etc. may cause serious harm to human
life or have severe social ramications. As such, any
inductors to be used in such equipment may require
higher safety and/or reliability considerations and
should be clearly differentiated from components used
in general purpose applications.
Operating Current Verication of Rated current
1. The operating current for inductors must always be
lower than their rated values.
2. Do not apply current in excess of the rated value
because the inductance may be reduced due to the
magnetic saturation effect.
Technical considerations
Stages
Precautions
2. PCB Design
Pattern congurations
Design of Land-patterns
1. When inductors are mounted on a PCB, the size of
land patterns and the amount of solder used size
of fillet can directly affect inductor performance.
Therefore, the following items must be carefully con-
sidered in the design of solder land patterns:
1 The amount of solder applied can affect the ability
of chips to withstand mechanical stresses which
may lead to breaking or cracking. Therefore, when
designing land-patterns it is necessary to consider
the appropriate size and conguration of the solder
pads which in turn determines the amount of solder
necessary to form the llets.
2 When more than one part is jointly soldered onto
the same land or pad, the pad must be designed so
that each component's soldering point is separated
by solder-resist.
3 The larger size of land patterns and amount of
solder, the smaller Q value after mounting on PCB.
It makes higher the Q value to design land patterns
smaller than terminal electrode of chips.
1. The following diagrams and tables show some examples of recommended
patterns to prevent excessive solder amounts larger llets which extend
above the component end terminations . Examples of improper pattern
designs are also shown.
1 Recommended land dimensions for a typical chip inductor land patterns
for PCBs
Recommended land dimensions for reow-soldering unit: mm
Size
Excess solder can affect the ability of chips to withstand mechanical stresses.
Therefore, please take proper precautions when designing land-patterns.
Recommended land dimensions for wave-soldering unit: mm
Recommended land
dimension for
Reow-soldering unit: mm
3216
2010
L
3.2
2.0
W
1.6
1.0
a
0.7 0.9
0.5 0.6
b
0.8 1.0
0.5 0.6
c
0.4 0.5
0.2 0.3
d
0.8
0.5
Size
Type
0603
1005
105
1608
2125
3216
2520
L
0.6
1.0
1.6
2.0
3.2
2.5
W
0.3
0.5
0.6
0.8
1.25
1.6
2.0
A
0.20 0.30 0.45 0.55 0.50 0.55 0.6 0.8
0.8 1.2
1.8 2.5
1.0 1.4
B
0.20 0.30 0.40 0.50 0.30 0.40 0.6 0.8
0.8 1.2
0.6 1.5
0.6 1.0
C
0.25 0.40 0.45 0.55 0.60 0.70 0.6 0.8
0.9 1.6
1.2 2.0
1.8 2.2
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