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參數(shù)資料
| 型號： | HI5960IA |
| 廠商： | INTERSIL CORP |
| 元件分類： | DAC |
| 英文描述： | CONNECTOR ACCESSORY |
| 中文描述： | PARALLEL, WORD INPUT LOADING, 0.035 us SETTLING TIME, 14-BIT DAC, PDSO28 |
| 封裝： | PLASTIC, MO-153-AE, TSSOP-28 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 88K |
| 代理商： | HI5960IA |
11
HI5960
Thin Shrink Small Outline Plastic Packages (TSSOP)
α
INDEX
AREA
E1
D
N
1
2
3
-B-
0.10(0.004)
C A
M
B S
e
-A-
b
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
c
E
0.25(0.010)
B
M
M
L
0.25
0.010
GAUGE
PLANE
A2
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AE, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension“b”doesnotincludedambarprotrusion.Allowabledambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
0.05(0.002)
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.051
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.378
0.386
9.60
9.80
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
0.65 BSC
-
E
0.246
0.256
6.25
6.50
-
L
0.0177
0.0295
0.45
0.75
6
N
α
28
28
7
0
o
8
o
0
o
8
o
-
Rev. 0 6/98
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| HI5960IA-T | 功能描述:CONV D/A 14BIT 130MSPS 28-TSSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標準包裝:2,400 系列:- 設(shè)置時間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
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| HI5960IAZ-T | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 28 -40 85C 14 BIT 125MSPS CMOS DACPE RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| HI5960IB | 功能描述:IC DAC 14-BIT 130MSPS 28-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標準包裝:2,400 系列:- 設(shè)置時間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
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