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參數(shù)資料
| 型號(hào)： | HI5760BIB |
| 廠商： | INTERSIL CORP |
| 元件分類： | DAC |
| 英文描述： | 10-Bit, 125/60MSPS, High Speed D/A Converter |
| 中文描述： | PARALLEL, WORD INPUT LOADING, 0.035 us SETTLING TIME, 10-BIT DAC, PDSO28 |
| 封裝： | PLASTIC, MS-013-AE, SOIC-28 |
| 文件頁(yè)數(shù)： | 16/18頁(yè) |
| 文件大?。?/td> | 172K |
| 代理商： | HI5760BIB |
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16
Pin Descriptions
PIN NO.
PIN NAME
PIN DESCRIPTION
1-10
D9 (MSB) Through
D0 (LSB)
Digital Data Bit 9, (Most Significant Bit) through Digital Data Bit 0, (Least Significant Bit).
11-14
NC
No Connect. Recommend ground.
15
SLEEP
ControlPinforPower-Downmode.SleepModeisactivehigh;ConnecttogroundforNormalMode.Sleep
pin has internal 20
μ
A active pulldown current.
16
REFLO
Connect to analog ground to enable internal 1.2V reference or connect to AV
DD
to disable internal
reference.
17
REFIO
Reference voltage input if internal reference is disabled. Reference voltage output if internal reference is
enabled. Use 0.1
μ
F cap to ground when internal reference is enabled.
18
FSADJ
Full Scale Current Adjust. Use a resistor to ground to adjust full scale output current. Full Scale Output
Current = 32 x V
FSADJ
/R
SET
.
19
COMP1
For use in reducing bandwidth/noise. Recommended: connect 0.1
μ
F to AV
DD
.
20
ACOM
Analog Ground.
21
IOUTB
The complimentary current output of the device. Full scale output current is achieved when all input bits
are set to binary 0.
22
IOUTA
Current output of the device. Full scale output current is achieved when all input bits are set to binary 1.
23
NC
Internally connected to ACOM via a resistor. Recommend leave disconnected. Adding a capacitor to
ACOM for upward compatibility is valid. Grounding to ACOM is valid. (For upward compatibility to 12-bit
and 14-bit devices, pin 23 needs the ability to have a 0.1
μ
F capacitor to ACOM.)
24
AV
DD
Analog Supply (+3V to +5V).
25
NC
No Connect. (For upward compatibility to 12 and 14b devices, pin 25 needs to be grounded to ACOM.)
26
DCOM
Digital Ground.
27
DV
DD
Digital Supply (+3V to +5V).
28
CLK
Input for clock. Positive edge of clock latches data.
HI5760
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HI5760 | 10-Bit, 125/60MSPS, High Speed D/A Converter |
| HI5760EVAL1 | 10-Bit, 125/60MSPS, High Speed D/A Converter |
| HI5760IA | CONNECTOR ACCESSORY |
| HI5766EVAL1 | 10-Bit, 60 MSPS A/D Converter |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HI5760BIB-T | 功能描述:CONV D/A 10-BIT 125MSPS 28-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| HI5760BIBZ | 功能描述:數(shù)模轉(zhuǎn)換器- DAC D/A 10-BIT 125MSPS 28PIN INDUST TEMP RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| HI5760BIBZ-T | 功能描述:數(shù)模轉(zhuǎn)換器- DAC D/A 10-BIT 125MSPS 28PIN INDUST TEMP RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| HI5760EVAL1 | 功能描述:數(shù)據(jù)轉(zhuǎn)換 IC 開發(fā)工具 HI5760 EVAL PL ATFORM PKG RoHS:否 制造商:Texas Instruments 產(chǎn)品:Demonstration Kits 類型:ADC 工具用于評(píng)估:ADS130E08 接口類型:SPI 工作電源電壓:- 6 V to + 6 V |
| HI5760EVALI | 制造商:Harris Corporation 功能描述: |
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