參數(shù)資料
型號(hào)： HGT1S3N60A4S
廠商： INTERSIL CORP
元件分類： IGBT 晶體管
英文描述： 600V, SMPS Series N-Channel IGBT
中文描述： 17 A, 600 V, N-CHANNEL IGBT, TO-263AB
文件頁(yè)數(shù)： 10/10頁(yè)
文件大?。?/td> 156K
代理商： HGT1S3N60A4S
10
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
HGTD3N60A4S, HGT1S3N60A4S, HGTP3N60A4
TO-220AB
3 LEAD JEDEC TO-220AB PLASTIC PACKAGE
E
P
Q
D
H
1
E
1
L
L
1
60
o
b
1
b
1
2
e
3
e
1
A
c
J
1
45
o
D
1
A
1
TERM. 4
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.170
0.180
4.32
4.57
-
A
1
b
0.048
0.052
1.22
1.32
-
0.030
0.034
0.77
0.86
3, 4
b
1
c
0.045
0.055
1.15
1.39
2, 3
0.014
0.019
0.36
0.48
2, 3, 4
D
0.590
0.610
14.99
15.49
-
D
1
E
-
0.160
-
4.06
-
0.395
0.410
10.04
10.41
-
E
1
e
-
0.030
-
0.76
-
0.100 TYP
2.54 TYP
5
e
1
H
1
J
1
L
0.200 BSC
5.08 BSC
5
0.235
0.255
5.97
6.47
-
0.100
0.110
2.54
2.79
6
0.530
0.550
13.47
13.97
-
L
1
P
0.130
0.150
3.31
3.81
2
0.149
0.153
3.79
3.88
-
Q
0.102
0.112
2.60
2.84
-
NOTES:
1. These dimensions are within allowable dimensions of Rev. J of
JEDEC TO-220AB outline dated 3-24-87.
2. Lead dimension and finish uncontrolled in L
1
.
3. Lead dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder coating.
5. Position of lead to be measured 0.250 inches (6.35mm) from bot-
tom of dimension D.
6. Position of lead to be measured 0.100 inches (2.54mm) from bot-
tom of dimension D.
7. Controlling dimension: Inch.
8. Revision 2 dated 7-97.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HGT1S3N60A4S9A 制造商:Fairchild Semiconductor Corporation 功能描述:
HGT1S3N60B3DS 制造商:Harris Corporation 功能描述:
HGT1S3N60B3DS9A 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TRANSISTOR | IGBT | N-CHAN | 600V V(BR)CES | 3.5A I(C) | TO-263AB
HGT1S3N60B3S 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Harris Corporation 功能描述:
HGT1S3N60B3S9A 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TRANSISTOR | IGBT | N-CHAN | 600V V(BR)CES | 3.5A I(C) | TO-263AB
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