參數(shù)資料
型號(hào): HFA5253CB
廠商: Harris Corporation
英文描述: 800MHz, Ultra High-Speed Monolithic Pin Driver
中文描述: 800MHz的,超高速單片管腳驅(qū)動(dòng)
文件頁數(shù): 18/18頁
文件大?。?/td> 527K
代理商: HFA5253CB
106
HFA5253
Power Small Outline Plastic Packages (PSOP)
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
μ
α
0.25(0.010)
B
M
M
N
1
2
3
D1
E1
POWER SOP PACKAGE
(HEAT SLUG SURFACE IS ELECTRICALLY FLOATING)
TOP VIEW
M20.3A
20 LEAD POWER SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.4961
0.5118
12.60
13.00
3
D1
0.325
0.340
8.25
8.63
10
E
0.2914
0.2992
7.40
7.60
4
E1
0.175
0.190
4.44
4.82
10
e
0.050 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
α
20
20
7
0
o
8
o
0
o
8
o
-
Rev. 0 6/95
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or
gate burrs. Mold flash, protrusion and gate burrs shall not ex-
ceed 0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm
(0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a vi-
sual index feature must be located within the crosshatched
area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or
greater above the seating plane, shall not exceed a maxi-
mum value of 0.61mm (0.024 inch)
10. Exposed copper heat slug flush with top surface of package.
All other dimensions conform to JEDEC MS-013AC Issue C.
11. Controlling dimension: MILLIMETER. Converted inch di-
mensions are not necessarily exact.
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