參數(shù)資料
型號(hào)： HD64F3643P
英文描述： IC-8-BIT MCU
中文描述： 集成電路8位微控制器
文件頁(yè)數(shù)： 26/67頁(yè)
文件大?。?/td> 382K
代理商： HD64F3643P
Rev. 2.0, 03/06/02, 23
2.5
Build Configurations
The HEW allows you to store all of your build options into a build configuration (figure 2.14). This means that
you can “freeze” all of the options and give them a name. Later on, you can select that configuration and all of
the options for all of the build phases will be restored. These build configurations also allow the user to specify
debugger settings for a build configuration. This means that each configuration can be targeted at a different end
platform. (See chapter 7, “Debugging your HEW project”, in the Hitachi Embedded Workshop 2.1 HEW
Debugger User’s Manual, for further information).
Figure 2.14 shows three build configurations; “Default”, “MyDebug” and “MyOptimized”. In the first
configuration, “Default”, each of the phases (compile and assemble) are set to their standard settings. In the
second configuration, “MyDebug”, each of the files are being built with debug information switched on. In the
third configuration, “MyOptimized”, each of the files are being built with optimization on full and without any
debug information. The developer of this project can select any of those configurations and build them without
having to return to the options dialogs to set them again.
C
Source Files
Assembler
Source Files
C:\MyProject\Default
"Default"
Configuration
C:\MyProject\MyDebug
"MyDebug"
Configuration
C:\MyProject\MyOptimized
"MyOptimized"
Configuration
Debug:
ON
Optimize: OFF
List File:
YES
Debug:
ON
Optimize: OFF
List File:
NO
Debug:
OFF
Optimize: ON
List File:
NO
Debug:
OFF
Optimize: ON
List File:
NO
Debug:
OFF
Optimize: OFF
List File:
YES
Debug:
ON
Optimize: OFF
List File:
NO
Figure 2.14: Configurations and File Options
相關(guān)PDF資料
PDF描述
HD64F3644H 16-Bit Microcontroller
HD64F3644P 16-Bit Microcontroller
HD64F3664 H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool
HD64F3664BP Microcontroller
HD64F3664FP Microcontroller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F3644 制造商:Renesas Electronics Corporation 功能描述:
HD64F3644D 功能描述:MCU 8BIT 3/5V 32K 64QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300L 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲(chǔ)器容量:384KB（384K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁(yè)面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD64F3644DV 功能描述:IC H8/3644 MCU FLASH 64QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300L 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲(chǔ)器容量:384KB（384K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁(yè)面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD64F3644H 功能描述:IC H8 MCU FLASH 32K 64-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300L 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲(chǔ)器容量:384KB（384K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁(yè)面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD64F3644HIV 制造商:Renesas Electronics Corporation 功能描述:
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