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參數(shù)資料
| 型號(hào)： | HD64F3039F |
| 英文描述： | Microcontroller |
| 中文描述： | 微控制器 |
| 文件頁數(shù)： | 26/67頁 |
| 文件大?。?/td> | 382K |
| 代理商： | HD64F3039F |
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Rev. 2.0, 03/06/02, 23
2.5
Build Configurations
The HEW allows you to store all of your build options into a build configuration (figure 2.14). This means that
you can “freeze” all of the options and give them a name. Later on, you can select that configuration and all of
the options for all of the build phases will be restored. These build configurations also allow the user to specify
debugger settings for a build configuration. This means that each configuration can be targeted at a different end
platform. (See chapter 7, “Debugging your HEW project”, in the Hitachi Embedded Workshop 2.1 HEW
Debugger User’s Manual, for further information).
Figure 2.14 shows three build configurations; “Default”, “MyDebug” and “MyOptimized”. In the first
configuration, “Default”, each of the phases (compile and assemble) are set to their standard settings. In the
second configuration, “MyDebug”, each of the files are being built with debug information switched on. In the
third configuration, “MyOptimized”, each of the files are being built with optimization on full and without any
debug information. The developer of this project can select any of those configurations and build them without
having to return to the options dialogs to set them again.
C
Source Files
Assembler
Source Files
C:\MyProject\Default
"Default"
Configuration
C:\MyProject\MyDebug
"MyDebug"
Configuration
C:\MyProject\MyOptimized
"MyOptimized"
Configuration
Debug:
ON
Optimize: OFF
List File:
YES
Debug:
ON
Optimize: OFF
List File:
NO
Debug:
OFF
Optimize: ON
List File:
NO
Debug:
OFF
Optimize: ON
List File:
NO
Debug:
OFF
Optimize: OFF
List File:
YES
Debug:
ON
Optimize: OFF
List File:
NO
Figure 2.14: Configurations and File Options
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HD64F3039TE | Microcontroller |
| HD64F3039VF | Microcontroller |
| HD64F3039VTE | Microcontroller |
| HD64F3048B | Microcomputer Development Environment System H8S.H8/300 Series High-Performance Embedded Workshop 2 User＇s Manual/Cross tool |
| HD64F3052B | H8/3048 Series. H8/3052 Series.H8/3062 Series. H8/3067 Series.H8/3007 Series E6000 Emulator HS3064BEPI61H Supplementary Information User＇s Manual/Emulator |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F3039F18 | 制造商:Renesas Electronics Corporation 功能描述:MCU 16-Bit/32-Bit H8 CISC 128KB Flash 5V 80-Pin PQFP Bulk 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit/32-bit H8 CISC 128KB Flash 5V 80-Pin PQFP |
| HD64F3039F18(V) | 制造商:Toshiba 功能描述:Cut Tape |
| HD64F3039F18V | 制造商:Renesas Electronics Corporation 功能描述:Micro,H8/3039,ROM 128k FL,RAM |
| HD64F3039FI18 | 制造商:Renesas Electronics Corporation 功能描述:H8/3039 MCU FLASH 18 MHZ |
| HD64F3039TE18V | 制造商:Renesas Electronics Corporation 功能描述: 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8 CISC 128KB Flash 5V 80-Pin TQFP |
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