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| 型號： | HD64F3039F |
| 英文描述： | Microcontroller |
| 中文描述： | 微控制器 |
| 文件頁數(shù)： | 10/67頁 |
| 文件大?。?/td> | 382K |
| 代理商： | HD64F3039F |
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Rev. 2.0, 03/06/02, 9
2.
Build Basics
This chapter explains the general functions of the HEW whilst the more advanced features can be found in
chapter 3, “Advanced Build Features”.
2.1
The Build Process
The typical build process is outlined in figure 2.1. This may not be the exact build process, which your
installation of HEW will use as it depends upon the tools that were provided with your installation of HEW (e.g.
you may not have a compiler for instance). In any case, the principles are the same - each step or phase of the
build takes a set of project files and then builds them, if all succeeds then the next step or phase is executed.
Project
Object
Files
C
Source Files
Assembler
Source Files
Library
Files
Load
Module
BUILD
COMPILER
ASSEMBLER
LINKER
Figure 2.1: Typical Build Process
In the example shown in figure 2.1 the compiler is the first phase, the assembler is the second phase and the
linker is the third and final phase. During the compiler phase, the C source files from the project are compiled in
turn, during the assembler phase, the assembler source files are assembled in turn. During the linker phase all
library files and output files from the compiler and assembler phases are linked together to produce the load
module. This module can then be downloaded and used by the debugger functionality in HEW.
The build process can be customized in several ways. For instance, you can add your own phase, disable a phase,
delete phases and so forth. These advanced build issues are left to chapter 3, “Advanced Build Features”. In this
chapter, only the general principles and basic features will be detailed.
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PDF描述 |
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| HD64F3039TE | Microcontroller |
| HD64F3039VF | Microcontroller |
| HD64F3039VTE | Microcontroller |
| HD64F3048B | Microcomputer Development Environment System H8S.H8/300 Series High-Performance Embedded Workshop 2 User＇s Manual/Cross tool |
| HD64F3052B | H8/3048 Series. H8/3052 Series.H8/3062 Series. H8/3067 Series.H8/3007 Series E6000 Emulator HS3064BEPI61H Supplementary Information User＇s Manual/Emulator |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F3039F18 | 制造商:Renesas Electronics Corporation 功能描述:MCU 16-Bit/32-Bit H8 CISC 128KB Flash 5V 80-Pin PQFP Bulk 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit/32-bit H8 CISC 128KB Flash 5V 80-Pin PQFP |
| HD64F3039F18(V) | 制造商:Toshiba 功能描述:Cut Tape |
| HD64F3039F18V | 制造商:Renesas Electronics Corporation 功能描述:Micro,H8/3039,ROM 128k FL,RAM |
| HD64F3039FI18 | 制造商:Renesas Electronics Corporation 功能描述:H8/3039 MCU FLASH 18 MHZ |
| HD64F3039TE18V | 制造商:Renesas Electronics Corporation 功能描述: 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8 CISC 128KB Flash 5V 80-Pin TQFP |
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