參數(shù)資料
型號(hào)： HD64F2552
英文描述： Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述： 微機(jī)開(kāi)發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊(cè)/交叉工具的性能
文件頁(yè)數(shù)： 29/67頁(yè)
文件大?。?/td> 382K
代理商： HD64F2552
Rev. 2.0, 03/06/02, 26
2.6
Building a Project
The outline of the build process is shown in figure 2.1.
2.6.1
Building a Project
The build option only compiles or assembles those files that have changed since the last build. Additionally, it
will rebuild source files if they depend upon a file that has changed since the last build. For instance, if the file
“test.c” #include’s the file “header.h” and the latter has changed since the last build, the file “test.c” will be
recompiled.
To perform a build:
Select [Build->Build] or click the build toolbar button (
) or press F7 or click the right mouse button on a
project icon in the “Projects” tab of the “Workspace” window and select [Build] from the pop-up menu.
The build all option compiles and assembles all source files, irrespective of whether they have been modified or
not, and links all of the new object files produced.
To perform a build all:
Select [Build->Build All], or click the build all toolbar button (
), or click the right mouse button on a
project icon in the “Projects” tab of the “Workspace” window and select [Build All] from the pop-up menu.
Both the build and the build all will terminate if any of the project files produce errors.
2.6.2
Building Individual Files
The Hitachi Embedded Workshop lets you build project files individually.
To build an individual file:
1. Select the file which you want to build from the project window.
2. Select [Build->Build File], click the build file toolbar button (
) or press CTRL+F7 or click the right
mouse button on a file icon in the “Projects” tab of the “Workspace” window and select [Build <file>]
from the pop-up menu.
相關(guān)PDF資料
PDF描述
HD64F2556 H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool
HD64F2612 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2612H Microcontroller
HD64F2623 H8S/2623F-ZTAT.On-Chip HCAN Application Notes/Q&A
HD64F2626 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2612FA20J 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 128KB FLASH 5V 80PQFP - Trays
HD64F2612FA20V 制造商:Renesas Electronics Corporation 功能描述:H8S FLASH - H8S/23, 26 LEADFREE - Trays
HD64F2623FA20 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB（64K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤(pán) 包裝:托盤(pán)
HD64F2623FA20J 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB（64K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤(pán) 包裝:托盤(pán)
HD64F2623FA20J/AU 制造商:Renesas Electronics Corporation 功能描述:
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