參數(shù)資料
型號: HD64F2552
英文描述: Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述: 微機(jī)開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能
文件頁數(shù): 27/67頁
文件大小: 382K
代理商: HD64F2552
Rev. 2.0, 03/06/02, 24
2.5.1
Selecting a Configuration
The current configuration can be set in two ways:
Either:
1. Select it from the drop down list box (figure 2.15) in the toolbar.
Figure 2.15: Toolbar Selection
or:
1. Select [Options->Build Configurations…]. This will invoke the “Build Configurations” Dialog (figure
2.16).
Figure 2.16: Build Configurations Dialog
2. Select the configuration that you want to use from the “Current configuration” drop down list.
3. Click “OK” to set the configuration.
2.5.2
Adding and Deleting Configurations
You can add a new configuration by copying settings from another configuration or delete a configuration. These
three tasks are described below.
To add a new configuration:
1. Select [Options->Build Configurations…] to display the “Build Configurations” dialog (figure 2.16).
2. Click the “Add…” button. The “Add Configuration” dialog will be invoked (figure 2.17).
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2612FA20J 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 128KB FLASH 5V 80PQFP - Trays
HD64F2612FA20V 制造商:Renesas Electronics Corporation 功能描述:H8S FLASH - H8S/23, 26 LEADFREE - Trays
HD64F2623FA20 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI,I²C,LIN,SPI,UART/USART 外圍設(shè)備:電容感應(yīng),DMA,LCD,POR,PWM,WDT 輸入/輸出數(shù):25 程序存儲器容量:64KB(64K x 8) 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b,D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2623FA20J 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI,I²C,LIN,SPI,UART/USART 外圍設(shè)備:電容感應(yīng),DMA,LCD,POR,PWM,WDT 輸入/輸出數(shù):25 程序存儲器容量:64KB(64K x 8) 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b,D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2623FA20J/AU 制造商:Renesas Electronics Corporation 功能描述: