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參數(shù)資料
| 型號： | HD64F2357 |
| 英文描述： | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| 中文描述： | 微機開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能 |
| 文件頁數(shù)： | 34/67頁 |
| 文件大小： | 382K |
| 代理商： | HD64F2357 |
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Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark,
or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for
problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the
information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest
product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s
sales office before using the product in an application that demands especially high quality and reliability or where its
failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics,
nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum
rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics.
Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the
guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ
systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury,
fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written
approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HD64F2357F | Microcontroller |
| HD64F2357TE | Microcontroller |
| HD64F2367 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
| HD64F2376 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2376R | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2357F13I | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2357F20 | 功能描述:IC H8S MCU FLASH 128K 128-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 標準包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲器容量:64KB（64K x 8） 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤 |
| HD64F2357F20IV | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2357F20V | 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8S CISC 128KB Flash 5V 128-Pin PQFP 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 128KB FLASH 5V 128PQFP - Trays 制造商:Renesas Electronics 功能描述:16 H8S/2300 20MHz 128QFP 128KB Tray 制造商:Renesas 功能描述:MCU 16-bit H8S CISC 128KB Flash 5V 128-Pin PQFP |
| HD64F2357F20-V | 制造商:Renesas Electronics Corporation 功能描述:IC,microcontroller,H8S/2357,QF |
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