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參數(shù)資料
| 型號： | HD64F2357 |
| 英文描述： | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| 中文描述： | 微機開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能 |
| 文件頁數(shù)： | 26/67頁 |
| 文件大?。?/td> | 382K |
| 代理商： | HD64F2357 |
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Rev. 2.0, 03/06/02, 23
2.5
Build Configurations
The HEW allows you to store all of your build options into a build configuration (figure 2.14). This means that
you can “freeze” all of the options and give them a name. Later on, you can select that configuration and all of
the options for all of the build phases will be restored. These build configurations also allow the user to specify
debugger settings for a build configuration. This means that each configuration can be targeted at a different end
platform. (See chapter 7, “Debugging your HEW project”, in the Hitachi Embedded Workshop 2.1 HEW
Debugger User’s Manual, for further information).
Figure 2.14 shows three build configurations; “Default”, “MyDebug” and “MyOptimized”. In the first
configuration, “Default”, each of the phases (compile and assemble) are set to their standard settings. In the
second configuration, “MyDebug”, each of the files are being built with debug information switched on. In the
third configuration, “MyOptimized”, each of the files are being built with optimization on full and without any
debug information. The developer of this project can select any of those configurations and build them without
having to return to the options dialogs to set them again.
C
Source Files
Assembler
Source Files
C:\MyProject\Default
"Default"
Configuration
C:\MyProject\MyDebug
"MyDebug"
Configuration
C:\MyProject\MyOptimized
"MyOptimized"
Configuration
Debug:
ON
Optimize: OFF
List File:
YES
Debug:
ON
Optimize: OFF
List File:
NO
Debug:
OFF
Optimize: ON
List File:
NO
Debug:
OFF
Optimize: ON
List File:
NO
Debug:
OFF
Optimize: OFF
List File:
YES
Debug:
ON
Optimize: OFF
List File:
NO
Figure 2.14: Configurations and File Options
相關PDF資料 |
PDF描述 |
|---|---|
| HD64F2357F | Microcontroller |
| HD64F2357TE | Microcontroller |
| HD64F2367 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
| HD64F2376 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2376R | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2357F13I | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2357F20 | 功能描述:IC H8S MCU FLASH 128K 128-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 標準包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設備:電容感應，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲器容量:64KB（64K x 8） 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉換器:A/D 2x20b，D/A 4x8b 振蕩器型:內部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤 |
| HD64F2357F20IV | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2357F20V | 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8S CISC 128KB Flash 5V 128-Pin PQFP 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 128KB FLASH 5V 128PQFP - Trays 制造商:Renesas Electronics 功能描述:16 H8S/2300 20MHz 128QFP 128KB Tray 制造商:Renesas 功能描述:MCU 16-bit H8S CISC 128KB Flash 5V 128-Pin PQFP |
| HD64F2357F20-V | 制造商:Renesas Electronics Corporation 功能描述:IC,microcontroller,H8S/2357,QF |
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