參數(shù)資料
型號(hào): HD6473837
英文描述: Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述: 微機(jī)開(kāi)發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊(cè)/交叉工具的性能
文件頁(yè)數(shù): 40/67頁(yè)
文件大?。?/td> 382K
代理商: HD6473837
Rev. 2.0, 03/06/02, 36
3.
Advanced Build Features
This chapter explains the more advanced build concepts.
3.1
The Build Process Revisited
Chapter 2, “Build Basics” began by describing the build process in terms of a compiler, an assembler and a
linker (figure 2.1). This will be the case for most installations of the Hitachi Embedded Workshop. However, if
you want to begin changing the build process (e.g. adding and removing phases) then it is important to
understand more about the way in which a build functions.
3.1.1
What is a Build?
Building a project means applying a set of tools upon certain input files in order to produce the desired output.
Thus, we apply a compiler upon C/C++ source files in order to create object files, we apply an assembler upon
assembler source files in order to create object files and so forth. At each step or “phase” of the build, we apply a
different tool upon a different set of input files. Figure 3.1 presents another view of the build process.
BEGIN
END
PHASE 1
PHASE 2
PHASE 3
PHASE X
Phase 1 Output Files
Phase 2 Output Files
Phase 1 Input Files
Phase 2 Input Files
Phase 3 Output Files
Phase X Output Files
Phase 3 Input Files
Phase X Input Files
Figure 3.1: Build Process
相關(guān)PDF資料
PDF描述
HD6473837F 16-Bit Microcontroller
HD6473837H 16-Bit Microcontroller
HD6473837U H8S.H8/300 Series Simulator/Debugger User's Manual/Cross tool
HD6473847 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD6473847F Microcontroller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD6473837FV 功能描述:IC H8/3837 MCU FLASH 100QFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300L 標(biāo)準(zhǔn)包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C,LIN,SCI,SPI 外圍設(shè)備:LCD,LVD,POR,PWM,WDT 輸入/輸出數(shù):53 程序存儲(chǔ)器容量:32KB(32K x 8) 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤(pán)
HD6473837H 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8 CISC 60KB ROM 3.3V/5V 100PQFP - Trays
HD6473837HI 制造商:Renesas Electronics Corporation 功能描述:
HD6473837HV 功能描述:MCU 3/5V 60K PB-FREE 100-QFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300L 標(biāo)準(zhǔn)包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C,LIN,SCI,SPI 外圍設(shè)備:LCD,LVD,POR,PWM,WDT 輸入/輸出數(shù):53 程序存儲(chǔ)器容量:32KB(32K x 8) 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤(pán)
HD6473837UF 制造商:Renesas Electronics Corporation 功能描述: