參數(shù)資料
型號： GS88218AB-133I
廠商： GSI TECHNOLOGY
元件分類： SRAM
英文描述： 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs
中文描述： 512K X 18 CACHE SRAM, 8.5 ns, PBGA119
封裝： PLASTIC, BGA-119
文件頁數(shù)： 29/38頁
文件大?。?/td> 1065K
代理商： GS88218AB-133I
GS88218/36AB/D-250/225/200/166/150/133
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.04 11/2004
35/38
2001, GSI Technology
256K x 36
GS88236AD-250
Pipeline/Flow Through
165 BGA (var. 1)
250/5.5
C
256K x 36
GS88236AD-225
Pipeline/Flow Through
165 BGA (var. 1)
225/6
C
256K x 36
GS88236AD-200
Pipeline/Flow Through
165 BGA (var. 1)
200/6.5
C
256K x 36
GS88236AD-166
Pipeline/Flow Through
165 BGA (var. 1)
166/7
C
256K x 36
GS88236AD-150
Pipeline/Flow Through
165 BGA (var. 1)
150/7.5
C
256K x 36
GS88236AD-133
Pipeline/Flow Through
165 BGA (var. 1)
133/8.5
C
512K x 18
GS88218AD-250I
Pipeline/Flow Through
165 BGA (var.1 )
250/5.5
I
512K x 18
GS88218AD-225I
Pipeline/Flow Through
165 BGA (var.1 )
225/6
I
512K x 18
GS88218AD-200I
Pipeline/Flow Through
165 BGA (var.1 )
200/6.5
I
512K x 18
GS88218AD-166I
Pipeline/Flow Through
165 BGA (var.1 )
166/7
I
512K x 18
GS88218AD-150I
Pipeline/Flow Through
165 BGA (var.1 )
150/7.5
I
512K x 18
GS88218AD-133I
Pipeline/Flow Through
165 BGA (var.1 )
133/8.5
I
256K x 36
GS88236AD-250I
Pipeline/Flow Through
165 BGA (var.1 )
250/5.5
I
256K x 36
GS88236AD-225I
Pipeline/Flow Through
165 BGA (var.1 )
225/6
I
256K x 36
GS88236AD-200I
Pipeline/Flow Through
165 BGA (var.1 )
200/6.5
I
256K x 36
GS88236AD-166I
Pipeline/Flow Through
165 BGA (var.1 )
166/7
I
256K x 36
GS88236AD-150I
Pipeline/Flow Through
165 BGA (var.1 )
150/7.5
I
256K x 36
GS88236AD-133I
Pipeline/Flow Through
165 BGA (var.1 )
133/8.5
I
Ordering Information for GSI Synchronous Burst RAMs
Org
Part Number1
Type
Package
Speed2
(MHz/ns)
TA3
Status
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS88236A-133IT.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings
相關(guān)PDF資料
PDF描述
GS88218AB-150 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs
GS88218AB-150I 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs
GS88218AB-166 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs
GS88218AB-166I 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs
GS88218AB-200 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GS88218CB-200 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 2.5V/3.3V 9MBIT 512KX18 6.5NS/3NS 119FPBGA - Trays
GS88218CB-200I 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 2.5V/3.3V 9MBIT 512KX18 6.5NS/3NS 119FPBGA - Trays
GS88218CB-200IV 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 1.8V/2.5V 9MBIT 512KX18 6.5NS/3NS 119FPBGA - Trays
GS88218CB-200V 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 1.8V/2.5V 9MBIT 512KX18 6.5NS/3NS 119FPBGA - Trays
GS88218CB-250 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 2.5V/3.3V 9MBIT 512KX18 5.5NS/2.5NS 119FPBGA - Trays
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