- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄223865 > GS8342D11BD-500 (GSI TECHNOLOGY) 4M X 9 QDR SRAM, 0.45 ns, PBGA165 PDF資料下載
參數(shù)資料
| 型號： | GS8342D11BD-500 |
| 廠商： | GSI TECHNOLOGY |
| 元件分類： | SRAM |
| 英文描述： | 4M X 9 QDR SRAM, 0.45 ns, PBGA165 |
| 封裝： | 13 X 15 MM, 1 MM PITCH, FPBGA-165 |
| 文件頁數(shù)： | 5/31頁 |
| 文件大?。?/td> | 950K |
| 代理商： | GS8342D11BD-500 |
第1頁第2頁第3頁第4頁當前第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁
Absolute Maximum Ratings
(All voltages reference to VSS)
Symbol
Description
Value
Unit
VDD
Voltage on VDD Pins
–0.5 to 2.9
V
VDDQ
Voltage in VDDQ Pins
–0.5 to VDD
V
VREF
Voltage in VREF Pins
–0.5 to VDDQ
V
VI/O
Voltage on I/O Pins
–0.5 to VDDQ +0.5 (≤ 2.9 V max.)
V
VIN
Voltage on Other Input Pins
–0.5 to VDDQ +0.5 (≤ 2.9 V max.)
V
IIN
Input Current on Any Pin
+/–100
mA dc
IOUT
Output Current on Any I/O Pin
+/–100
mA dc
TJ
Maximum Junction Temperature
125
oC
TSTG
Storage Temperature
–55 to 125
oC
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Recommended Operating Conditions, for an extended period of time, may affect
reliability of this component.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.00 4/2011
13/31
2011, GSI Technology
Preliminary
GS8342D06/11/20/38BD-550/500/450/400/350
Recommended Operating Conditions
Power Supplies
Parameter
Symbol
Min.
Typ.
Max.
Unit
Supply Voltage
VDD
1.7
1.8
1.9
V
I/O Supply Voltage
VDDQ
1.4
—
VDD
V
Reference Voltage
VREF
VDDQ/2 – 0.05
—
VDDQ/2 + 0.05
V
Notes:
The power supplies need to be powered up simultaneously or in the following sequence: VDD, VDDQ, VREF, followed by signal inputs. The power
down sequence must be the reverse. VDDQ must not exceed VDD. For more information, read AN1021 SigmaQuad and SigmaDDR Power-Up.
Operating Temperature
Parameter
Symbol
Min.
Typ.
Max.
Unit
Junction Temperature
(Commercial Range Versions)
TJ
0
25
85
°C
Junction Temperature
(Industrial Range Versions)*
TJ
–40
25
100
°C
Note:
* The part numbers of Industrial Temperature Range versions end with the character “I”. Unless otherwise noted, all performance specifications
quoted are evaluated for worst case in the temperature range marked on the device.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| GS8342D11BD-550IT | 4M X 9 QDR SRAM, 0.45 ns, PBGA165 |
| GS8342D37BD-300I | 1M X 36 QDR SRAM, 0.45 ns, PBGA165 |
| GS8342QT07BD-357 | 4M X 8 QDR SRAM, 0.45 ns, PBGA165 |
| GS8342QT10BGD-300T | 4M X 9 QDR SRAM, 0.45 ns, PBGA165 |
| GS8342TT06BGD-500T | 4M X 8 DDR SRAM, 0.45 ns, PBGA165 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GS8342D11BD-550 | 制造商:GSI Technology 功能描述:165 FBGA - Bulk |
| GS8342D11BD-550I | 制造商:GSI Technology 功能描述:165 FBGA - Bulk |
| GS8342D18AE-200 | 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 1.8V 36MBIT 2MX18 0.45NS 165FPBGA - Trays |
| GS8342D18AE-333 | 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 1.8V 36MBIT 2MX18 0.45NS 165FPBGA - Trays |
| GS8342D18AGE-200 | 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 1.8V 36MBIT 2MX18 0.45NS 165FPBGA - Trays |
發(fā)布緊急采購，3分鐘左右您將得到回復。