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參數(shù)資料
| 型號： | G1432F3U |
| 廠商： | Global Mixed-mode Technology Inc. |
| 元件分類： | 音頻放大器 |
| 英文描述： | 2W Stereo Audio Amplifier |
| 中文描述： | 2W立體聲音頻放大器 |
| 文件頁數(shù)： | 15/15頁 |
| 文件大小： | 340K |
| 代理商： | G1432F3U |
Ver: 1.1
Jun 21, 2006
TEL: 886-3-5788833
http://www.gmt.com.tw
9
G1432
Global Mixed-mode Technology Inc.
Pin Description
PIN
TSSOP
QFN
NAME
I/O
FUNCTION
1,12,13,24 9,10,21,22
GND/HS
Ground connection for circuitry, directly connected to thermal pad.
2,9,11
6,8,23
NC
Embedded test mode pin, please keep it floating.
3
24
LOUT+
O
Left channel + output in BTL mode
4
1
LIN1
I
Left channel IN1 input, selected when
1
IN /IN2 pin is held low.
5
2
LIN2
I
Left channel IN2 input, selected when
1
IN /IN2 pin is held high.
6
3
LBYPASS
Connect to voltage divider for left channel internal mid-supply bias.
7
4
LVDD
I
Supply voltage input for left channel and for primary bias circuits.
8
5
SHUTDOWN
I
Shutdown mode control signal input, places entire IC in shutdown mode
when held high, IDD < 5A.
10
7
LOUT-
O
Left channel - output in BTL mode.
14
11
MUTE
I
Mode control signal input, hold low for activation, hold high for mute.
15
12
ROUT-
O
Right channel - output in BTL mode
16
13
1
IN
/IN2
I
MUX control input, hold high to select in2 inputs (5,20)/(2/17), hold low to
select in1 inputs (4,21)/(1,18).
17
14
GND
Ground connection for circuitry.
18
15
RVDD
I
Supply voltage input for right channel.
19
16
RBYPASS
Connect to voltage divider for right channel internal mid-supply bias.
20
17
RIN2
I
Right channel in2 input, selected when
1
IN /IN2 pin is held high.
21
18
RIN1
I
Right channel lin1 input, selected when
1
IN /IN2 pin is held low.
22
19
ROUT+
O
Right channel + output in BTL mode
23
20
VOL
I
The output power can be clamped by setting a low bound voltage to this pin.
The high bound voltage will be generated internally. The output voltage will
be clamped between high/low bound voltages. Then the output power is lim-
ited. It is weakly pull-low internally, let this pin floating or tied to GND can
deactivate this function.
Thermal
Pad
Thermal
Pad
Recommend connecting the Thermal Pad to the GND for excellent power
dissipation.
Recommended Minimum Footprint
TSSOP-24 (FD)
QFN4X4-24
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