參數(shù)資料
型號(hào)： FW250R1
廠商： LINEAGE POWER LLC
元件分類： 電源模塊
英文描述： 1-OUTPUT 256.95 W DC-DC REG PWR SUPPLY MODULE
封裝： MODULE-20
文件頁(yè)數(shù)： 6/20頁(yè)
文件大?。?/td> 561K
代理商： FW250R1
14
Lineage Power
Data Sheet
April 2008
36 Vdc to 75 Vdc Input, 28 Vdc Output; 250 W to 300 W
FW250R1 and FW300R1 Power Modules: dc-dc Converters:
Thermal Considerations (continued)
Heat Transfer with Heat Sinks
The power modules have through-threaded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to be attached to the module. The mounting torque
must not exceed 0.56 N-m (5 in.-lb.). For the screw
attachment from the pin side, the recommended hole
size on the customer’s PWB around the mounting
holes is 0.130 ± 0.005 inches. If a larger hole is used,
the mounting torque from the pin side must not exceed
0.25 N-m (2.2 in.-lb.).
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total mod-
ule thermal resistance (
θca) is dened as the maximum
case temperature rise (
TC, max) divided by the module
power dissipation (PD):
The location to measure case temperature (TC) is
shown in Figure 18. Case-to-ambient thermal resis-
tance vs. airow for various heat sink congurations is
shown in Figures 21 and 22. These curves were
obtained by experimental testing of heat sinks, which
are offered in the product catalog.
8-1321 (C)
Figure 21. Case-to-Ambient Thermal Resistance
Curves; Transverse Orientation
8-1320 (C)
Figure 22. Case-to-Ambient Thermal Resistance
Curves; Longitudinal Orientation
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figures 21 and
22 had a thermal-conductive dry pad between the case
and the heat sink to minimize contact resistance.
To choose a heat sink, determine the power dissipated
as heat by the unit for the particular application.
Figure 23 shows typical heat dissipation for a range of
output currents and three voltages for the FW250R1.
8-1723 (C)
Figure 23. FW250R1 Power Dissipation vs. Output
Current at 25 °C
θca
TC max
,
PD
---------------------
TC
TA
–
()
PD
------------------------
==
0.0
0.5
3.0
3.5
4.0
4.5
2.5
2.0
1.0
1 1/2 IN. HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
1.5
AIR VELOCITY, m/s (ft./min.)
0
0.5
(100)
1.0
(200)
1.5
(300)
2.0
(400)
2.5
(500)
3.0
(600)
CASE-TO-AMBIENT
THERMAL
RESISTANCE,
θ
CA
(
°C/W)
0
0.5
(100)
1.0
(200)
1.5
(300)
2.0
(400)
2.5
(500)
3.0
(600)
0.0
0.5
3.0
3.5
4.0
4.5
2.5
2.0
1.0
1 1/2 IN. HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
CASE-TO-AMBIENT
THERMAL
RESISTANCE,
θ
CA
(
°C/W)
1.5
AIR VELOCITY, m/s (ft./min.)
12
6
7
89
0
22
OUTPUT CURRENT, IO (A)
12
8
18
30
0
26
4
5
3
14
20
10
6
16
28
24
2
POWER
DISSPATION,
P
D
(V)
VI = 54 V
VI = 75 V
VI = 36 V
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