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參數(shù)資料
| 型號： | FW250H1 |
| 廠商： | LINEAGE POWER LLC |
| 元件分類： | 電源模塊 |
| 英文描述： | DC-DC REG PWR SUPPLY MODULE |
| 文件頁數(shù)： | 6/20頁 |
| 文件大小： | 839K |
| 代理商： | FW250H1 |
Lineage Power
14
Data Sheet
April 2008
36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Thermal Considerations (continued)
Introduction (continued)
The temperature at this location should not exceed
100 °C. The maximum case temperature can be limited
to a lower value for extremely high reliability. The output
power of the module should not exceed the rated power
for the module as listed in the Ordering Information
table.
For additional information about these modules, refer
to the Thermal Management for FC- and FW-Series
250 W—300 W Board-Mounted Power Modules Tech-
nical Note (TN96-009EPS).
Heat Transfer Without Heat Sinks
Derating curves for forced-air cooling without a heat
be used to determine the appropriate airflow for a given
set of operating conditions. For example, if the unit with
airflow along its length dissipates 20 W of heat, the
correct airflow in a 40 °C environment is 1.0 m/s
(200 ft./min.).
8-1315
Figure 21. Convection Power Derating with No Heat
Sink; Airflow Along Width (Transverse)
8-1314
Figure 22. Convection Power Derating with No Heat
Sink; Airflow Along Length
(Longitudinal)
Heat Transfer with Heat Sinks
The power modules have through-threaded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to be attached to the module. The mounting torque
must not exceed 0.56 N-m (5 in.-lb.). For the screw
attachment from the pin side, the recommended hole
size on the customer’s PWB around the mounting
holes is 0.130 ± 0.005 inches. If a larger hole is used,
the mounting torque from the pin side must not exceed
0.25 N-m (2.2 in.-lbs.).
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total
module thermal resistance (
θca) is defined as the max-
imum case temperature rise (
ΔTC, max) divided by the
module power dissipation (PD):
The location to measure case temperature (TC) is
shown in Figure 20. Case-to-ambient thermal resis-
tance vs. airflow for various heat sink configurations is
shown in Figure 23 and Figure 24. These curves were
obtained by experimental testing of heat sinks, which
are offered in the product catalog.
0
102030
40
100
0
70
50
40
20
90
80
70
60
50
10
30
60
LOCAL AMBIENT TEMPERATURE, TA (
°C)
P
O
WER
DISSIPATION,
P
D
(W
)
4.0 m/s (800 ft./min.)
3.5 m/s (700 ft./min.)
3.0 m/s (600 ft./min.)
2.5 m/s (500 ft./min.)
2.0 m/s (400 ft./min.)
1.5 m/s (300 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
0.1 m/s (20 ft./min.) NAT. CONV.
010
203040
100
0
70
50
40
20
90
80
70
60
50
10
30
60
LOCAL AMBIENT TEMPERATURE, TA (
°C)
POW
ER
DISSIP
ATION,
P
D
(W
)
4.0 m/s (800 ft./min.)
3.5 m/s (700 ft./min.)
3.0 m/s (600 ft./min.)
2.5 m/s (500 ft./min.)
2.0 m/s (400 ft./min.)
1.5 m/s (300 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
0.1 m/s (20 ft./min.) NAT. CONV.
θca
ΔTCmax
,
PD
---------------------
TC TA
–
()
PD
------------------------
==
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