參數(shù)資料
型號(hào): FTF3020-C
廠商: NXP Semiconductors N.V.
英文描述: Full Frame CCD Image Sensor
中文描述: 全幀CCD圖像傳感器
文件頁(yè)數(shù): 15/16頁(yè)
文件大?。?/td> 212K
代理商: FTF3020-C
1999 November
15
Philips Semiconductors
Product specification
Full Frame CCD Image Sensor
FTF3020-C
Package information
Figure 13 - Mechanical drawing of the PGA package of the FTF3020-C
A is the center of the image area.
Position of A:
26.35 ± 0.15 to left edge of package
20.00 ± 0.15 to upper edge of package
1.7 ± 0.15 to bottom of package
Angle of rotation: less than ± 1°
Sensor flatness: < 20 μm (P-V)
Cover glass: Corning 7059
Thickness of cover glass: 1 ± 0.05
Refractive index: n
= 1.53
Double sided AR coating < 1% (430-660 nm) reflection
All drawing units are in mm
3
0
48.26
±
0.27
Chip - bottom package 1.7 ±0.15
1.4 / 100
COVER GLASS
SENSOR CRYSTAL
Chip - cover glass 1.3 ±0.20
EPOXY GLUE
A
TOP VIEW
INDEX
MARK
PIN 1
52.7
±
0.53
26.35
±
0.15
1
2
0
0.46
±
0.05
(2.54)
STAND-OFF PIN
COVER GLASS
4
0
BOTTOM VIEW
Cover glass 1.0 ±0.05
Image sensor chip
4
0
Top cover glass to top chip 2.4 ±0.25
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