參數(shù)資料
型號: FTF1100MF1
廠商: INFINEON TECHNOLOGIES AG
元件分類: 模擬信號調(diào)理
英文描述: SPECIALTY ANALOG CIRCUIT, XMA
文件頁數(shù): 26/39頁
文件大小: 400K
代理商: FTF1100MF1
FingerTIP
Infineon Technologies
32/38
FTF 1100 MF1 V2.0 databook 3.3 (05.00)
4.7 Recommended Electrical Connection of the FingerTIP in SPI Mode
21 Protec. GND
20 Vcc
19 GND
18 NC
17 NC
16 NC
15 NC
14 NC
13 NC
12 SO
11 /CS
10 SCK
9 SI
8 NC
7 NC
6 NC
5 NC
4 NC
3 EPP/SPI
2 GND
1 Protec. GND
Vcc
GND
Molex - FFC/FPC
Connect pin 1 and 21 to protective ground
Protective GND
R1 (e.g. 33
)
10F
GND
R4 (
≥ 22)
10F
R1, R2, R5
(e.g. 1K
)
SPI
Interface
IN
OUT
Figure 18: Typically circuit for Interfacing the FingerTIP to an SPI Interface
The serial resistors in the micro-controller output lines are used for current limitation and
should be placed close to the sensor. The value of these resistors is dependent on the
maximum output current, and supply voltage of the micro-controller. It is recommended to
select values of the resistors such that the maximum current flowing into the sensor via the
I/O lines is less than 15mA.
The resistors in the VCC and GND line are also required for limiting the maximum supply
current to the sensor and ESD protection. The nominal voltage shift induced on the sensor
output signals is typically not and issue, but if required, a line driver can be employed for
shifting the signals back to TTL levels.
If using additional SPI devices on the same SPI bus it must be guaranteed that the
maximum current supplying the sensor via the I/O pins is limited to 15mA. Buffers can
achieve decoupling of the FingerTIP from other SPI devices. If using a cable between the
sensor and a micro-controller it must be shielded and have a maximum length of
1.5meters. The sensor side of the cable shield must be connected with a dedicated line
directly to pins1 and 21 of the sensor connector. Never connect signal ground with
protective ground at sensor side of the cable. At the micro-controller side of the cable, the
shield must be connected to protective ground. It is critical to isolate the sensor protective
ground from the device power ground for optimum ESD performance.
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