參數(shù)資料
型號(hào): FSSD07UMX
廠商: Fairchild Semiconductor
文件頁(yè)數(shù): 5/14頁(yè)
文件大?。?/td> 0K
描述: IC MUX 2:1 SD/SDIO/MMC 24-UMLP
標(biāo)準(zhǔn)包裝: 1
類型: 多路復(fù)用器
應(yīng)用: 手機(jī),數(shù)碼相機(jī),媒體播放器
安裝類型: 表面貼裝
封裝/外殼: 24-UFQFN
供應(yīng)商設(shè)備封裝: 24-UMLP
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面: 1219 (CN2011-ZH PDF)
其它名稱: FSSD07UMXDKR
2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSSD07 Rev. 1.0.2
13
FSSD07
1-Bit
/
4-Bit
SD/SDIO
and
MMC
Dual-Host
Multiplexer
Physical Dimensions
TOP VIEW
BOTTOM VIEW
RECOMMENDED LAND PATTERN
0.10 C
0.08 C
B
A
C
0.10 C
2X
SIDE VIEW
SEATING
PLANE
0.10 C
0.05
0.00
7
13
1
0.10 CA B
0.05 C
0.55 MAX.
PIN #1 IDENT
19
2.50
3.40
0.40
0.15
0.25 24X
0.45
0.55
0.35
0.45
23X
0.15
24
3.70
2.80
2.23
1
7
13
19
24
0.40
0.56
0.23
0.66
Figure 17. 24-Lead, Ultra-thin Molded Leadless Package (UMLP), 0.4mm pitch
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packaging/MicroMLP24_TNR.pdf
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