參數(shù)資料
型號: FMA219
英文描述: X-BAND LNA MMIC
中文描述: X波段單片低噪聲放大器
文件頁數(shù): 3/5頁
文件大?。?/td> 328K
代理商: FMA219
PRELIMINARY
FMA219
X-BAND
LNA
MMIC
Phone:
+1 408 850-5790
Fax:
+1 408 850-5766
http://
www.filtronic.co.uk/semis
Revised:
11/22/04
Email:
sales@filcsi.com
ASSEMBLY DRAWING
Notes:
Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25μm) diameter wire. The
bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is
recommended. Ultrasonic or thermosonic bonding is
not
recommended.
The recommended die attach is conductive epoxy, following the manufacturer’s recommended curing procedure.
For eutectic die attach the maximum time at 280-300°C is 60 seconds, and should be kept to a minium.
The supply de-coupling capacitor (150 pF recommended value) should be placed as close to the MMIC as practical.
All information and specifications subject to change without notice.
75
μ
m nominal gap on
each side
250
μ
m Au ribbon
recommended
25
μ
m dia. Au wire (x2) on
input and output ports, less
than 1000
μ
m length each
To +V
DD
Input and output thin film
substrates with 50
microstrip
transmission lines. Substrate
thickness 250
μ
m or thinner is
recommended.
150pF
capacitor
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