- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄223792 > FLIP Flip Chip TVS Evaluation and Assembly Guide (101k) PDF資料下載
參數(shù)資料
| 型號(hào)： | FLIP |
| 英文描述： | Flip Chip TVS Evaluation and Assembly Guide (101k) |
| 中文描述： | 倒裝芯片二極管評(píng)價(jià)和大會(huì)指南（101k） |
| 文件頁(yè)數(shù)： | 2/3頁(yè) |
| 文件大小： | 101K |
| 代理商： | FLIP |
2
2001 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
SI00-06
Surging Ideas
TVS Diode Application Note
solder mask/ball interface is eliminated.
The traces to the pads should be 0.100 mm or less and
1 oz copper layer thickness. Large traces can lead to
excess solder wicking on one side of the component
resulting in “tombstoning” (leaning to one side) of the
component.
Board Finish
A uniform board finish is critical for good assembly
yield. Two finishes that provide uniform surface
coatings are immersion nickel gold and organic surface
protectant (OSP). A non-uniform finish such as hot air
solder leveling (HASL) can lead to mounting problems
and should be avoided. If a gold finish is used, the
thickness of the immersion gold should be kept to less
than 0.5 micron in order to avoid solder joint
embrittlement.
Board Assembly
Initially, OSP finished boards were used and were
assembled without solder paste. A water soluble,
tacky flux was used to mount the devices to the board.
Other assembly variations that Semtech has evaluated
are OSP finish with solder paste, immersion gold with
solder paste, immersion gold with flux, and fused tin/
lead with solder paste. In cases where solder paste is
used, a paste with a Sn62/Pb36/Ag2 or Sn62.8/
Pb36.8/Ag0.4 composition and type 4 or finer powder
is recommended. The small amount of silver
impregnation is recommended for slowing the eutectic
transition point and thus reducing the possibility of
tombstoning. Some experimentation may be required
Figure 2 - NSMD Package Footprint
Figure 3 - Stencil Design
Table 1 - Summary of assembly information for SFC05-4 CSP TVS
Copper Pad Dimension
0.200mm, round
Copper pad Definition
Non solder mask defined (NSMD)
Copper Pad Pitch
0.500mm
Solder Mask Opening
0.3500mm
Soldering Stencil Thickness
0.100mm
Soldering Stencil Aperture Opening
0.275mm Square with rounded corners
Soldering Stencil Fabrication Method
Laser cut, electro-polished
Solder Paste Specification
Type 4,
Sn62/Pb36/Ag2 or Sn62.8/Pb36.8/Ag0.4
Flux Specification
No Clean or tacky, water-soluble
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| FLJ-ACO1 | Consumer IC |
| FLJ-ACR1 | Digital Potentiometer |
| FLJ-ACR2 | Digital Potentiometer |
| FLJ-D1 | Analog Filter |
| FLJ-D2 | Analog Filter |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| FLIPCHIP11 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:4-BIT DUAL SUPPLY BUS BUFFER LEVEL TRANSLATOR WITH A SIDE SERIES RESISTOR |
| FLIR A15SC | 制造商:FLIR COMMERCIAL SYSTEMS 功能描述:FLIR A15 Imager (160 x 128)/f = 9 mm (48 deg x 39 deg) Lens with Science Kit |
| FLIR A5SC | 制造商:FLIR COMMERCIAL SYSTEMS 功能描述:FLIR A5 Imager (80 x 64)/f = 5 mm (44 deg x 36 deg) Lens with Science Kit |
| FLIR B200 | 功能描述:熱成像器 BldgTher Imag IR Cam 200x150 Res/9Hz RoHS:否 制造商:Fluke 溫度范圍:- 20 C to + 600 C 分辨率:280 X 210 靈敏度:0.05 C 準(zhǔn)確性:2 % 顯示器類型:LCD |
| FLIR B300 | 功能描述:熱成像器 BldgTher Imag IR Cam 320x240 Res/2X RoHS:否 制造商:Fluke 溫度范圍:- 20 C to + 600 C 分辨率:280 X 210 靈敏度:0.05 C 準(zhǔn)確性:2 % 顯示器類型:LCD |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。