參數(shù)資料
型號(hào): FAN5365UC06X
廠商: FAIRCHILD SEMICONDUCTOR CORP
元件分類: 穩(wěn)壓器
英文描述: 1.84 A SWITCHING REGULATOR, 6600 kHz SWITCHING FREQ-MAX, PBGA9
封裝: 1.27 X 1.29 MM, 0.40 MM PITCH, WLCSP-9
文件頁(yè)數(shù): 19/24頁(yè)
文件大?。?/td> 1014K
代理商: FAN5365UC06X
2008 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN5365 Rev. 1.0.4
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute
maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Units
VCC
VIN, SW Pins
–0.3
6.5
V
VOUT
–0.3
2.5
Other Pins
–0.3
VIN + 0.3
(7)
ESD
Electrostatic Discharge Protection
Human Body Model, JESD22-A114
3
KV
Charged Device Model, JESD22-C101
1
TJ
Junction Temperature
–40
+150
°C
TSTG
Storage Temperature
–65
+150
°C
TL
Lead Soldering Temperature, 10 Seconds
+260
°C
Note:
7.
Lesser of 6.5V or VCC+0.3V.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Min.
Max.
Units
VIN
Supply Voltage
2.3
5.5
V
VCCIO
SDA and SCL Voltage Swing
(8)
1.2
2.0
V
TA
Ambient Temperature
–40
+85
°C
TJ
Junction Temperature
–40
+125
°C
Note:
8.
The I
2C interface operates with tHD;DAT = 0 as long as the pull-up voltage for SDA and SCL is less than 2.5V. If voltage
swings greater than 2.5V are required (for example, if the I
2C bus is pulled up to VIN), the minimum tHD;DAT must be
increased to 80ns. Most I
2C masters change SDA near the midpoint between the falling and rising edges of SCL, which
provides ample tHD;DAT.
Dissipation Ratings(9)
Package
RθJA
(10)
Power Rating
at TA ≤ 25°C
Derating Factor
> TA = 25C
Wafer-Level Chip-Scale Package (WLCSP)
110C/W
900mW
9mW/C
Notes:
9.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any
allowable ambient temperature is PD = [TJ(max) - TA ] / θJA.
10. This thermal data is measured with a high-K board (four-layer board, according to the JESD51-7 JEDEC standard).
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