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參數(shù)資料
| 型號(hào)： | FAB2200UCX |
| 廠商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA25 |
| 封裝： | 0.40 MM PITCH, WLCSP-25 |
| 文件頁(yè)數(shù)： | 1/33頁(yè) |
| 文件大?。?/td> | 948K |
| 代理商： | FAB2200UCX |
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June 2011
2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAB2200 Rev. 1.0.1
FAB2200
—
Audio
Subsystem
with
Ster
eo
Class-G
Headph
on
eAmplifier
FAB2200
Audio Subsystem with Stereo Class-G Headphone
Amplifier and 1.2W Mono Class-D Speaker Amplifier
Features
Single Supply: 2.8V – 5.25V
Pop and Click Suppression
Differential or Single-Ended Audio Inputs
Rejects TDMA Noise from GSM Handsets
Filterless Fully Differential Class-D Speaker
Amplifier
Programmable Edge-Rate Control and Spread
Spectrum Minimize EMI
1.2W into 8 at 4.2V, THD+N < 10%
970mW into 8 at 4.2V, THD+N < 1%
90% Efficiency
Automatic Gain Control Limits Distortion and
Protects Speakers at All Battery Voltages
Noise Gate Improves Audio Quality
Headphone Amplifier
Power-Saving Class-G Operation
Audio Taper I2C Volume Control
Capacitor-Free Outputs
Integrated Regulated Charge Pump
SGND Pin Eliminates Ground-Loop Noise
Noise Gate Improves Audio Quality
DPST Analog Bypass Switch
I2C Control
Low-Power Shutdown Mode
Current Limit and Thermal Protection
25-Bump, 0.4mm Pitch WLCSP Package
Description
The FAB2200 combines a capacitor-free stereo
headphone amplifier with a monolithic class-D
speaker amplifier.
An integrated charge pump generates multiple supply
rails for a ground-centered class-G headphone
output. The charge pump is regulated for high Power
Supply Rejection Ratio (PSRR).
The filterless class-D amplifier can be connected
directly to a speaker without external filters.
The programmable Automatic Gain Control (AGC)
limits maximum speaker output levels to protect
speakers without introducing distortion. It can also
dynamically limit clipping as the battery voltage falls.
The noise gate can automatically mute the speaker or
headphone amplifiers to reduce noise when input
signals are low.
Applications
Cellular Handsets
Notebook Computers
Tablet PCs
Ordering Information
Part Number
Operating Temperature Range
Package
Packing Method
FAB2200UCX
-40 to +85°C
25-Bump, 0.4mm Pitch, Wafer-Level
Chip-Scale Package (WLCSP)
3000 Units on
Tape & Reel
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