參數(shù)資料
型號(hào)： EVAL-AD7854CB
廠商： Analog Devices, Inc.
英文描述： 3 V to 5 V Single Supply, 200 kSPS 12-Bit Sampling ADCs
中文描述： 3 V至5 V單電源，200 kSPS的12位采樣ADC
文件頁(yè)數(shù)： 5/28頁(yè)
文件大?。?/td> 264K
代理商： EVAL-AD7854CB
AD7854/AD7854L
REV. B
–5–
ORDERING GUIDE
Linearity
Error
(LSB)
Power
Dissipation
(mW)
Temperature
Range
1
–40
°
C to +85
°
C
–55
°
C to +125
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Package
Option
2
Model
AD7854AQ
AD7854SQ
AD7854AR
AD7854BR
AD7854ARS
AD7854LAQ
3
AD7854LAR
3
AD7854LARS
3
EVAL-AD7854CB
4
EVAL-CONTROL BOARD
5
1
1
1
1/2
1
1
1
1
15
15
15
15
15
5.5
5.5
5.5
Q-28
Q-28
R-28
R-28
RS-28
Q-28
R-28
RS-28
NOTES
1
Linearity error refers to the integral linearity error.
2
Q = Cerdip; R = SOIC; RS = SSOP.
3
L signifies the low power version.
4
This can be used as a stand-alone evaluation board or in conjunction with the EVAL-CONTROL BOARD for
evaluation/demonstration purposes.
5
This board is a complete unit allowing a PC to control and communicate with all Analog Devices evaluation boards
ending in the CB designator. For more information on Analog Devices products and evaluation boards visit our
World Wide Web home page at http://www.analog.com.
TO
OUTPUT
PIN
+2.1V
I
OH
1.6mA
200μA
I
OL
C
L
50pF
Figure 1. Load Circuit for Digital Output Timing
Specifications
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25
°
C unless otherwise noted)
AV
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DV
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AV
DD
to DV
DD
. . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Analog Input Voltage to AGND . . . . –0.3 V to AV
DD
+ 0.3 V
Digital Input Voltage to DGND . . . . –0.3 V to DV
DD
+ 0.3 V
Digital Output Voltage to DGND . . . –0.3 V to DV
DD
+ 0.3 V
REF
IN
/REF
OUT
to AGND . . . . . . . . . –0.3 V to AV
DD
+ 0.3 V
Input Current to Any Pin Except Supplies
2
. . . . . . . . .
±
10 mA
Operating Temperature Range
Commercial (A, B Versions) . . . . . . . . . . . –40
°
C to +85
°
C
Commercial (S Version) . . . . . . . . . . . . . . –55
°
C to +125
°
C
Storage Temperature Range . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°
C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75
°
C/W
Lead Temperature, (Soldering, 10 secs) . . . . . . . . . +300
°
C
SOIC, SSOP Package, Power Dissipation . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . 75
°
C/W (SOIC) 115
°
C/W (SSOP)
θ
JC
Thermal Impedance . . . 25
°
C/W (SOIC) 35
°
C/W (SSOP)
Lead Temperature, Soldering
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latchup.
PIN CONFIGURATION
FOR DIP, SOIC AND SSOP
14
13
12
11
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
17
16
15
20
19
18
28
27
26
25
24
23
22
21
AD7854
CONVST
DB10
DB11
CLKIN
BUSY
WR
RD
CS
DV
DD
DB8
DGND
DB9
REF
IN
/REF
OUT
AV
DD
AGND
C
REF1
C
REF2
AIN(+)
DB6
DB7
AIN(
–
)
HBEN
DB0
DB1
DB5
DB2
DB3
DB4
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