參數(shù)資料
型號(hào)： EVAL-AD7715-5EB
廠商： Analog Devices, Inc.
英文描述： 3 V/5 V, 450 uA 16-Bit, Sigma-Delta ADC
中文描述： 3伏/ 5伏，450微安16位Σ-Δ模數(shù)轉(zhuǎn)換器
文件頁數(shù)： 6/31頁
文件大?。?/td> 474K
代理商： EVAL-AD7715-5EB
REV. C
AD7715
–6–
ORDERING GUIDE
AV
DD
Supply
Temperature
Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Evaluation Board
Evaluation Board
Package
Options*
Model
AD7715AN-5
AD7715AR-5
AD7715ARU-5
AD7715AN-3
AD7715AR-3
AD7715ARU-3
AD7715AChips-5
AD7715AChips-3
EVAL-AD7715-5EB
EVAL-AD7715-3EB
5 V
5 V
5 V
3 V
3 V
3 V
5 V
3 V
5 V
3 V
N-16
R-16
RU-16
N-16
R-16
RU-16
Die
Die
*N = Plastic DIP; R = SOIC RU = TSSOP.
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25
°
C unless otherwise noted)
AV
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to +7V
AV
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to +7V
AV
DD
to DV
DD
. . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to +7V
DV
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to +7V
DV
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to +7V
DGND to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3V to +7V
Analog Input Voltage to AGND . . . . . –0.3 V to AV
DD
+ 0.3V
Reference Input Voltage to AGND . . . –0.3 V to AV
DD
+ 0.3V
Digital Input Voltage to DGND . . . . .–0.3 V to DV
DD
+ 0.3 V
Digital Output Voltage to DGND . . . .–0.3 V to DV
DD
+ 0.3 V
Operating Temperature Range
Commercial (A Version) . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°
C
Plastic DIP Package, Power Dissipation . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105
°
C/W
Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . +260
°
C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . .450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 128
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
Power Dissipation (Any Package) to +75
°
C . . . . . . . . 450 mW
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>4000 V
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
PIN CONFIGURATION
DIP, SOIC and TSSOP
14
13
12
11
16
15
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
AD7715
SCLK
DOUT
DIN
DV
DD
DGND
MCLK IN
MCLK OUT
CS
REF IN(+)
AGND
DRDY
RESET
AV
DD
AIN(+)
AIN(–)
REF IN(–)
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