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| 型號： | EPIC |
| 英文描述： | EPiC Family Product Line (304k) |
| 中文描述： | 史詩系列產(chǎn)品線（304k） |
| 文件頁數(shù)： | 3/12頁 |
| 文件大小： | 304K |
| 代理商： | EPIC |
11
www.semtech.com
HIGH PERFORMANCE PRODUCTS
Revision 1/December 3, 2001
AN1001
Thermal Analysis (con’d)
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A
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0
3
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1
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0
5
Transverse Air Flow
This is a common technique where cooled air is forced
along the top of the PC board. Cooling is achieved via
convection, as the cold air passing over the top of the
package absorbs the heat and carries it away, as well
as via conduction through the lead frame down into
the power planes inside the printed circuit board.
The following assumptions are made:
1)
the part is soldered to a multilayered PC board
with internal power planes
2)
laminar air flow.
DIE
TJ
19XX, 15XX, 44XX
Air Gap
Pad
Vias
Power Plane
PC Board
Power Plane
Heat Flow
In this environment:
qJA
w
o
l
F
r
i
A
0
4 o
W
/
CM
P
F
L
0
3
>
0
1M
P
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L
0
5M
P
F
L
Orthogonal Air Flow
DIE
TJ
19XX, 15XX, 44X X
Air Gap
Pad
Vias
Power Plane
PC Board
Power Plane
Heat Flow
High Pressure Air
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