參數(shù)資料
型號: EPF6016BC256-2
廠商: Altera
文件頁數(shù): 50/52頁
文件大?。?/td> 0K
描述: IC FLEX 6000 FPGA 16K 256-BGA
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 40
系列: FLEX 6000
LAB/CLB數(shù): 132
邏輯元件/單元數(shù): 1320
輸入/輸出數(shù): 204
門數(shù): 16000
電源電壓: 4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 256-BBGA
供應(yīng)商設(shè)備封裝: 256-BGA(27x27)
Altera Corporation
7
FLEX 6000 Programmable Logic Device Family Data Sheet
The interleaved LAB structure—an innovative feature of the FLEX 6000
architecture—allows each LAB to drive two local interconnects. This
feature minimizes the use of the FastTrack Interconnect, providing higher
performance. An LAB can drive 20 LEs in adjacent LABs via the local
interconnect, which maximizes fitting flexibility while minimizing die
size. See Figure 2.
Figure 2. Logic Array Block
In most designs, the registers only use global clock and clear signals.
However, in some cases, other clock or asynchronous clear signals are
needed. In addition, counters may also have synchronous clear or load
signals. In a design that uses non-global clock and clear signals, inputs
from the first LE in an LAB are re-routed to drive the control signals for
that LAB. See Figure 3.
The 10 LEs in the LAB are driven by two
local interconnect areas. The LAB can drive
two local interconnect areas.
Row Interconnect
Local Interconnect
The row interconnect is
bidirectionally connected
to the local interconnect.
Column Interconnect
LEs can directly drive the row
and column interconnect.
To/From
Adjacent
LAB or IOEs
To/From
Adjacent
LAB or IOEs
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF6016BC256-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 6000 132 LABs 204 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6016BC256-3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 6000 132 LABs 204 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6016QC208-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 6000 132 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6016QC208-2N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 6000 132 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6016QC2083 制造商:ALTERA 功能描述:*