參數(shù)資料
型號(hào)： EPF10K30AQI208-3N
廠商： Altera
文件頁數(shù)： 13/128頁
文件大?。?/td> 0K
描述： IC FLEX 10KA FPGA 30K 208-PQFP
產(chǎn)品培訓(xùn)模塊： Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝： 24
系列： FLEX-10K®
LAB/CLB數(shù)： 216
邏輯元件/單元數(shù)： 1728
RAM 位總計(jì)： 12288
輸入/輸出數(shù)： 147
門數(shù)： 69000
電源電壓： 3 V ~ 3.6 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 208-BFQFP
供應(yīng)商設(shè)備封裝： 208-PQFP（28x28）
Altera Corporation
11
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Larger blocks of RAM are created by combining multiple EABs. For
example, two 256
× 8 RAM blocks can be combined to form a
256
× 16 RAM block; two 512 × 4 blocks of RAM can be combined to form
a 512
× 8RAM block. See Figure 3.
Figure 3. Examples of Combining EABs
If necessary, all EABs in a device can be cascaded to form a single RAM
block. EABs can be cascaded to form RAM blocks of up to 2,048 words
without impacting timing. Altera’s software automatically combines
EABs to meet a designer’s RAM specifications.
EABs provide flexible options for driving and controlling clock signals.
Different clocks can be used for the EAB inputs and outputs. Registers can
be independently inserted on the data input, EAB output, or the address
and WE inputs. The global signals and the EAB local interconnect can drive
the WE signal. The global signals, dedicated clock pins, and EAB local
interconnect can drive the EAB clock signals. Because the LEs drive the
EAB local interconnect, the LEs can control the WE signal or the EAB clock
signals.
Each EAB is fed by a row interconnect and can drive out to row and
column interconnects. Each EAB output can drive up to two row channels
and up to two column channels; the unused row channel can be driven by
other LEs. This feature increases the routing resources available for EAB
outputs. See Figure 4.
512
× 4
512
× 4
256
× 8
256
× 8
256
× 16
512
× 8
相關(guān)PDF資料
PDF描述
HSC43DRAH CONN EDGECARD 86POS R/A .100 SLD
552079-1 CONN COVER STR RLF 14POS 180DEG
ABM43DSAS CONN EDGECARD 86POS R/A .156 SLD
EPF10K30AQI208-3 IC FLEX 10KA FPGA 30K 208-PQFP
EP20K100EBC356-3 IC APEX 20KE FPGA 100K 356-BGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF10K30AQI240-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 216 LABs 189 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K30AQI240-3N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 216 LABs 189 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K30ATC144-1 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 216 LABs 102 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K30ATC144-1N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 216 LABs 102 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K30ATC1442 制造商:ALTERA 功能描述:*
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*