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參數(shù)資料
| 型號(hào)： | EPF10K10AQC208-3 |
| 廠商： | Altera |
| 文件頁(yè)數(shù)： | 47/128頁(yè) |
| 文件大小： | 0K |
| 描述： | IC FLEX 10KA FPGA 10K 208-PQFP |
| 產(chǎn)品培訓(xùn)模塊： | Three Reasons to Use FPGA's in Industrial Designs |
| 標(biāo)準(zhǔn)包裝： | 72 |
| 系列： | FLEX-10K® |
| LAB/CLB數(shù)： | 72 |
| 邏輯元件/單元數(shù)： | 576 |
| RAM 位總計(jì)： | 6144 |
| 輸入/輸出數(shù)： | 134 |
| 門數(shù)： | 31000 |
| 電源電壓： | 3 V ~ 3.6 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 85°C |
| 封裝/外殼： | 208-BFQFP |
| 供應(yīng)商設(shè)備封裝： | 208-PQFP（28x28） |
| 產(chǎn)品目錄頁(yè)面： | 603 (CN2011-ZH PDF) |
| 其它名稱： | 544-1255 |
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Altera Corporation
25
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
FastTrack Interconnect
In the FLEX 10K architecture, connections between LEs and device I/O
pins are provided by the FastTrack Interconnect, which is a series of
continuous horizontal and vertical routing channels that traverse the
device. This global routing structure provides predictable performance,
even in complex designs. In contrast, the segmented routing in FPGAs
requires switch matrices to connect a variable number of routing paths,
increasing the delays between logic resources and reducing performance.
The FastTrack Interconnect consists of row and column interconnect
channels that span the entire device. Each row of LABs is served by a
dedicated row interconnect. The row interconnect can drive I/O pins and
feed other LABs in the device. The column interconnect routes signals
between rows and can drive I/O pins.
A row channel can be driven by an LE or by one of three column channels.
These four signals feed dual 4-to-1 multiplexers that connect to two
specific row channels. These multiplexers, which are connected to each
LE, allow column channels to drive row channels even when all eight LEs
in an LAB drive the row interconnect.
Each column of LABs is served by a dedicated column interconnect. The
column interconnect can then drive I/O pins or another row’s
interconnect to route the signals to other LABs in the device. A signal from
the column interconnect, which can be either the output of an LE or an
input from an I/O pin, must be routed to the row interconnect before it
can enter an LAB or EAB. Each row channel that is driven by an IOE or
EAB can drive one specific column channel.
Access to row and column channels can be switched between LEs in
adjacent pairs of LABs. For example, an LE in one LAB can drive the row
and column channels normally driven by a particular LE in the adjacent
LAB in the same row, and vice versa. This routing flexibility enables
routing resources to be used more efficiently. See Figure 11.
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| EPF10K10AQC208-3N | 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 72 LABs 134 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| EPF10K10AQI208-3 | 功能描述:IC FLEX 10KA FPGA 10K 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:FLEX-10K® 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA（34.55x34.55） |
| EPF10K10ATC100-1 | 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 72 LABs 66 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| EPF10K10ATC100-2 | 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 72 LABs 66 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| EPF10K10ATC100-3 | 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 72 LABs 66 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
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