參數(shù)資料
型號(hào): EPF10K10AQC208-3
廠商: Altera
文件頁數(shù): 2/128頁
文件大?。?/td> 0K
描述: IC FLEX 10KA FPGA 10K 208-PQFP
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 72
系列: FLEX-10K®
LAB/CLB數(shù): 72
邏輯元件/單元數(shù): 576
RAM 位總計(jì): 6144
輸入/輸出數(shù): 134
門數(shù): 31000
電源電壓: 3 V ~ 3.6 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 208-BFQFP
供應(yīng)商設(shè)備封裝: 208-PQFP(28x28)
產(chǎn)品目錄頁面: 603 (CN2011-ZH PDF)
其它名稱: 544-1255
10
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Logic functions are implemented by programming the EAB with a read-
only pattern during configuration, creating a large LUT. With LUTs,
combinatorial functions are implemented by looking up the results, rather
than by computing them. This implementation of combinatorial functions
can be faster than using algorithms implemented in general logic, a
performance advantage that is further enhanced by the fast access times
of EABs. The large capacity of EABs enables designers to implement
complex functions in one logic level without the routing delays associated
with linked LEs or field-programmable gate array (FPGA) RAM blocks.
For example, a single EAB can implement a 4
× 4 multiplier with eight
inputs and eight outputs. Parameterized functions such as LPM functions
can automatically take advantage of the EAB.
The EAB provides advantages over FPGAs, which implement on-board
RAM as arrays of small, distributed RAM blocks. These FPGA RAM
blocks contain delays that are less predictable as the size of the RAM
increases. In addition, FPGA RAM blocks are prone to routing problems
because small blocks of RAM must be connected together to make larger
blocks. In contrast, EABs can be used to implement large, dedicated blocks
of RAM that eliminate these timing and routing concerns.
EABs can be used to implement synchronous RAM, which is easier to use
than asynchronous RAM. A circuit using asynchronous RAM must
generate the RAM write enable (WE) signal, while ensuring that its data
and address signals meet setup and hold time specifications relative to the
WE
signal. In contrast, the EAB’s synchronous RAM generates its own WE
signal and is self-timed with respect to the global clock. A circuit using the
EAB’s self-timed RAM need only meet the setup and hold time
specifications of the global clock.
When used as RAM, each EAB can be configured in any of the following
sizes: 256
× 8, 512 × 4, 1,024 × 2, or 2,048 × 1. See Figure 2.
Figure 2. EAB Memory Configurations
256
× 8
512
× 4
1,024
× 2
2,048
× 1
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EPF10K10AQC208-3N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 72 LABs 134 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K10AQI208-3 功能描述:IC FLEX 10KA FPGA 10K 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:FLEX-10K® 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA(34.55x34.55)
EPF10K10ATC100-1 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 72 LABs 66 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K10ATC100-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 72 LABs 66 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K10ATC100-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 72 LABs 66 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256