參數(shù)資料
型號(hào): EPF10K100BFI256-2DX
英文描述: ASIC
中文描述: 專(zhuān)用集成電路
文件頁(yè)數(shù): 52/120頁(yè)
文件大?。?/td> 1901K
代理商: EPF10K100BFI256-2DX
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Altera Corporation
37
FLEX 10KE Embedded Programmable Logic Family Data Sheet
SameFrame
Pin-Outs
FLEX 10KE devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support a range of devices from an EPF10K30E device in a 256-pin
FineLine BGA package to an EPF10K200S device in a 672-pin
FineLine BGA package.
The MAX+PLUS II software provides support to design PCBs with
SameFrame pin-out devices. Devices can be defined for present and
future use. The MAX+PLUS II software generates pin-outs describing
how to lay out a board to take advantage of this migration (see Figure 18).
Figure 18. SameFrame Pin-Out Example
Designed for 256-Pin FineLine BGA Package
Printed Circuit Board
100-Pin FineLine BGA Package
(Reduced I/O Count or
Logic Requirements)
256-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
100-Pin
FineLine
BGA
256-Pin
FineLine
BGA
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF10K100BFI256-3DX 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:ASIC
EPF10K100BQC208-1 制造商:Rochester Electronics LLC 功能描述:- Bulk
EPF10K100BQC208-1DX 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:ASIC
EPF10K100BQC208-2 制造商:Rochester Electronics LLC 功能描述:- Bulk
EPF10K100BQC208-2DX 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:ASIC