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參數(shù)資料
| 型號(hào)： | EPF10K100ARI240-3N |
| 廠商： | Altera |
| 文件頁數(shù)： | 107/128頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FLEX 10KA FPGA 100K 240-RQFP |
| 產(chǎn)品培訓(xùn)模塊： | Three Reasons to Use FPGA's in Industrial Designs |
| 產(chǎn)品變化通告： | Package Change 30/Jun/2010 |
| 標(biāo)準(zhǔn)包裝： | 24 |
| 系列： | FLEX-10K® |
| LAB/CLB數(shù)： | 624 |
| 邏輯元件/單元數(shù)： | 4992 |
| RAM 位總計(jì)： | 24576 |
| 輸入/輸出數(shù)： | 189 |
| 門數(shù)： | 158000 |
| 電源電壓： | 3 V ~ 3.6 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 100°C |
| 封裝/外殼： | 240-BFQFP 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 240-RQFP（32x32） |
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Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
The logic array consists of logic array blocks (LABs). Each LAB contains
eight LEs and a local interconnect. An LE consists of a 4-input look-up
table (LUT), a programmable flipflop, and dedicated signal paths for carry
and cascade functions. The eight LEs can be used to create medium-sized
blocks of logic—8-bit counters, address decoders, or state machines—or
combined across LABs to create larger logic blocks. Each LAB represents
about 96 usable gates of logic.
Signal interconnections within FLEX 10K devices and to and from device
pins are provided by the FastTrack Interconnect, a series of fast,
continuous row and column channels that run the entire length and width
of the device.
Each I/O pin is fed by an I/O element (IOE) located at the end of each row
and column of the FastTrack Interconnect. Each IOE contains a
bidirectional I/O buffer and a flipflop that can be used as either an output
or input register to feed input, output, or bidirectional signals. When used
with a dedicated clock pin, these registers provide exceptional
performance. As inputs, they provide setup times as low as 1.6 ns and
hold times of 0 ns; as outputs, these registers provide clock-to-output
times as low as 5.3 ns. IOEs provide a variety of features, such as JTAG
BST support, slew-rate control, tri-state buffers, and open-drain outputs.
Figure 1 shows a block diagram of the FLEX 10K architecture. Each group
of LEs is combined into an LAB; LABs are arranged into rows and
columns. Each row also contains a single EAB. The LABs and EABs are
interconnected by the FastTrack Interconnect. IOEs are located at the end
of each row and column of the FastTrack Interconnect.
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