參數(shù)資料
型號(hào): EP7309-CB-C
廠商: CIRRUS LOGIC INC
元件分類(lèi): 微控制器/微處理器
英文描述: CONN MODULAR JACK 8-8 R/A UNSHLD
中文描述: RISC MICROCONTROLLER, PBGA256
封裝: 17 X 17 X 1.61 MM, PLASTIC, BGA-256
文件頁(yè)數(shù): 30/46頁(yè)
文件大?。?/td> 1893K
代理商: EP7309-CB-C
30
Copyright 2001 Cirrus Logic (All Rights Reserved)
DS507PP1
EP7309
High-Performance, Low-Power System on Chip
U2.155
154
C20
nPOR
U2.156
155
E18
nMEDCHG/nBROM
U2.157
156
B20
nURESET
U2.158
157
C17
VDDO
U2.159
158
B17
MOSCIN
U2.160
159
A17
MOSCOUT
U2.161
160
C16
GNDO
U2.162
161
B16
WAKEUP
U2.163
162
A16
nPWRFL
U2.164
163
C15
A6
U2.165
164
B15
D6
U2.166
165
A15
A5
U2.167
166
C14
D5
U2.168
167
A1
VDDR
U2.169
168
Y3
GNDR
U2.170
169
B14
A4
U2.171
170
A14
D4
U2.172
171
C13
A3
U2.173
172
B13
D3
U2.174
173
A13
A2
U2.175
174
Y3
GNDR
U2.176
175
C12
D2
U2.177
176
B12
A1
U2.178
177
A12
D1
U2.179
178
C11
A0
U2.180
179
B11
D0
U2.181
180
A11
GNDD
U2.182
181
C10
VDDD
U2.183
182
Y3
GNDR
U2.184
183
Y20
VDDR
U2.185
184
B10
CL2
U2.186
185
A10
CL1
U2.187
186
A9
FRM
U2.188
187
B9
M
U2.189
188
C9
DD3
U2.190
189
A8
DD2
U2.191
190
Y3
GNDR
U2.192
191
B8
DD1
U2.193
192
C8
DD0
Table T. 204-Ball TFBGA Ball List (Continued)
Die Pad
Bond Pad
Package Ball
Signal
U2.194
193
A7
N/C
U2.195
194
B7
N/C
U2.196
195
C7
N/C
U2.197
196
A6
N/C
U2.198
197
V18
VDDR
U2.199
198
B18
GNDR
U2.200
199
B6
N/C
U2.201
200
C6
N/C
U2.202
201
A5
nMWE
U2.203
202
B5
nMOE
U2.204
203
B18
GNDR
U2.205
204
C5
nCS0
U2.206
205
A4
nCS1
U2.207
206
B4
nCS2
U2.208
207
A3
nCS3
U2.209
208
C4
nCS4
A1
VDDR
B2
VDDR
C3
VDDR
D3
VDDR
K3
VDDR
L18
VDDR
V18
VDDR
V19
VDDR
W19
VDDR
Y20
VDDR
A18
GNDR
A19
GNDR
A20
GNDR
B18
GNDR
B19
GNDR
C18
GNDR
D18
GNDR
V2
GNDR
V3
GNDR
W1
GNDR
W2
GNDR
W3
GNDR
Table T. 204-Ball TFBGA Ball List (Continued)
Die Pad
Bond Pad
Package Ball
Signal
相關(guān)PDF資料
PDF描述
EP7309-CR-C HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE
EP7309-CV-C HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE
EP7309-ER-C HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE
EP7309-EV-C CONN MOD JACK 8-8 SHIELD TOP TAB
EP7309-EB-C HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP7309-CBZ 功能描述:音頻片上系統(tǒng) - SoC IC Ultra Low Power Audio Decode SOC RoHS:否 制造商:Cirrus Logic
EP7309-CR 制造商:Cirrus Logic 功能描述:SYS-ON-CHIP PROCESSOR 204TFBGA - Tape and Reel
EP7309-CR-C 制造商:CIRRUS 制造商全稱(chēng):Cirrus Logic 功能描述:HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE
EP7309-CV 功能描述:IC ARM720T MCU 74MHZ 208-LQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:EP7 標(biāo)準(zhǔn)包裝:1,500 系列:AVR® ATtiny 核心處理器:AVR 芯體尺寸:8-位 速度:16MHz 連通性:I²C,LIN,SPI,UART/USART,USI 外圍設(shè)備:欠壓檢測(cè)/復(fù)位,POR,PWM,溫度傳感器,WDT 輸入/輸出數(shù):16 程序存儲(chǔ)器容量:8KB(4K x 16) 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:512 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:20-SOIC(0.295",7.50mm 寬) 包裝:帶卷 (TR)
EP7309-CV-C 制造商:CIRRUS 制造商全稱(chēng):Cirrus Logic 功能描述:HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE