參數(shù)資料
型號: EP2AGX95EF29I3
廠商: Altera
文件頁數(shù): 21/90頁
文件大?。?/td> 0K
描述: IC ARRIA II GX FPGA 95K 780FBGA
標(biāo)準(zhǔn)包裝: 4
系列: Arria II GX
LAB/CLB數(shù): 3747
邏輯元件/單元數(shù): 89178
RAM 位總計: 6839296
輸入/輸出數(shù): 372
電源電壓: 0.87 V ~ 0.93 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 780-BBGA
供應(yīng)商設(shè)備封裝: 780-FBGA(29x29)
1–20
Chapter 1: Device Datasheet for Arria II Devices
Electrical Characteristics
December 2013
Altera Corporation
Table 1–33 lists the differential I/O standard specifications for Arria II GZ devices.
Power Consumption for the Arria II Device Family
Altera offers two ways to estimate power for a design:
Using the Microsoft Excel-based Early Power Estimator
Using the Quartus II PowerPlay Power Analyzer feature
The interactive Microsoft Excel-based Early Power Estimator is typically used prior to
designing the FPGA in order to get a magnitude estimate of the device power. The
Quartus II PowerPlay Power Analyzer provides better quality estimates based on the
specifics of the design after place-and-route is complete. The PowerPlay Power
Analyzer can apply a combination of user-entered, simulation-derived, and estimated
signal activities which, when combined with detailed circuit models, can yield very
accurate power estimates.
f For more information about power estimation tools, refer to the PowerPlay Early Power
Estimator User Guide and the PowerPlay Power Analysis chapter in volume 3 of the
Quartus II Handbook.
Table 1–33. Differential I/O Standard Specifications for Arria II GZ Devices (Note 1)
I/O
Standard
VCCIO (V)
VID (mV)
VICM(DC) (V)
VOD (V) (3)
VOCM (V) (3)
Min
Typ
Max
Min
Cond.
Max
Min
Max
Min
Typ
Max
Min
Typ
Max
2.5 V
LVDS
(HIO)
2.375
2.5
2.625
100
VCM =
1.25 V
0.05
1.8
0.247
0.6
1.125
1.25
1.375
2.5 V
LVDS
(VIO)
2.375
2.5
2.625
100
VCM =
1.25 V
0.05
1.8
0.247
0.6
1
1.25
1.5
RSDS
(HIO)
2.375
2.5
2.625
100
VCM =
1.25 V
0.3
1.4
0.1
0.2
0.6
0.5
1.2
1.4
RSDS
(VIO)
2.375
2.5
2.625
100
VCM =
1.25 V
0.3
1.4
0.1
0.2
0.6
0.5
1.2
1.5
Mini-LVDS
(HIO)
2.375
2.5
2.625
200
600
0.4
1.32
5
0.25
0.6
1
1.2
1.4
Mini-LVDS
(VIO)
2.375
2.5
2.625
200
600
0.4
1.32
5
0.25
0.6
1
1.2
1.5
LVPECL
2.375
2.5
2.625
300
0.6
1.8
2.375
2.5
2.625
100
Notes to Table 1–33:
(1) 1.4-V/1.5-V PCML transceiver I/O standard specifications are described in “Transceiver Performance Specifications” on page 1–21.
(2) Vertical I/O (VIO) is top and bottom I/Os; horizontal I/O (HIO) is left and right I/Os.
(3) RL range: 90 RL 110 .
(4) There are no fixed VICM, VOD, and VOCM specifications for BLVDS. These specifications depend on the system topology.
相關(guān)PDF資料
PDF描述
IDT71V3556S100PFG8 IC SRAM 4MBIT 100MHZ 100TQFP
EP2AGX65DF25I3 IC ARRIA II GX FPGA 65K 572FBGA
EP2AGX45DF29I3 IC ARRIA II GX FPGA 45K 780FBGA
IDT7164S20TPGI IC SRAM 64KBIT 20NS 28DIP
EP2AGX45DF25I3 IC ARRIA II GX FPGA 45K 572FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP2AGX95EF29I3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Arria II GX 3747 LABs 372 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2AGX95EF29I5 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Arria II GX 3747 LABs 372 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2AGX95EF29I5N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Arria II GX 3747 LABs 372 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2AGX95EF35C4 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Arria II GX 3747 LABs 452 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2AGX95EF35C4N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Arria II GX 3747 LABs 452 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256