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參數(shù)資料
| 型號： | EP20K200EFC484-2 |
| 廠商： | Altera |
| 文件頁數(shù)： | 107/117頁 |
| 文件大小： | 0K |
| 描述： | IC APEX 20KE FPGA 200K 484-FBGA |
| 產(chǎn)品培訓模塊： | Three Reasons to Use FPGA's in Industrial Designs |
| 標準包裝： | 60 |
| 系列： | APEX-20K® |
| LAB/CLB數(shù)： | 832 |
| 邏輯元件/單元數(shù)： | 8320 |
| RAM 位總計： | 106496 |
| 輸入/輸出數(shù)： | 376 |
| 門數(shù)： | 404000 |
| 電源電壓： | 1.71 V ~ 1.89 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 85°C |
| 封裝/外殼： | 484-BGA |
| 供應商設(shè)備封裝： | 484-FBGA（23x23） |
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Altera Corporation
9
APEX 20K Programmable Logic Device Family Data Sheet
Functional
Description
APEX 20K devices incorporate LUT-based logic, product-term-based
logic, and memory into one device. Signal interconnections within
APEX 20K devices (as well as to and from device pins) are provided by the
FastTrack Interconnect—a series of fast, continuous row and column
channels that run the entire length and width of the device.
Each I/O pin is fed by an I/O element (IOE) located at the end of each row
and column of the FastTrack Interconnect. Each IOE contains a
bidirectional I/O buffer and a register that can be used as either an input
or output register to feed input, output, or bidirectional signals. When
used with a dedicated clock pin, these registers provide exceptional
performance. IOEs provide a variety of features, such as 3.3-V, 64-bit,
66-MHz PCI compliance; JTAG BST support; slew-rate control; and
tri-state buffers. APEX 20KE devices offer enhanced I/O support,
including support for 1.8-V I/O, 2.5-V I/O, LVCMOS, LVTTL, LVPECL,
3.3-V PCI, PCI-X, LVDS, GTL+, SSTL-2, SSTL-3, HSTL, CTT, and 3.3-V
AGP I/O standards.
The ESB can implement a variety of memory functions, including CAM,
RAM, dual-port RAM, ROM, and FIFO functions. Embedding the
memory directly into the die improves performance and reduces die area
compared to distributed-RAM implementations. Moreover, the
abundance of cascadable ESBs ensures that the APEX 20K device can
implement multiple wide memory blocks for high-density designs. The
ESB’s high speed ensures it can implement small memory blocks without
any speed penalty. The abundance of ESBs ensures that designers can
create as many different-sized memory blocks as the system requires.
Figure 1 shows an overview of the APEX 20K device.
Figure 1. APEX 20K Device Block Diagram
LUT
Memory
IOE
LUT
Memory
IOE
Product Term
LUT
Memory
IOE
Product Term
FastTrack
Interconnect
Clock Management Circuitry
IOEs support
PCI, GTL+,
SSTL-3, LVDS,
and other
standards.
ClockLock
Four-input LUT
for data path and
DSP functions.
Product-term
integration for
high-speed
control logic and
state machines.
Flexible integration
of embedded
memory, including
CAM, RAM,
ROM, FIFO, and
other memory
functions.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| EP20K200EFC484-2ES | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FPGA |
| EP20K200EFC484-2N | 功能描述:FPGA - 現(xiàn)場可編程門陣列 CPLD - APEX 20K 832 Macro 376 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| EP20K200EFC484-2X | 功能描述:FPGA - 現(xiàn)場可編程門陣列 CPLD - APEX 20K 832 Macro 376 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| EP20K200EFC484-2XN | 功能描述:FPGA - 現(xiàn)場可編程門陣列 CPLD - APEX 20K 832 Macro 376 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| EP20K200EFC484-3 | 功能描述:FPGA - 現(xiàn)場可編程門陣列 CPLD - APEX 20K 832 Macro 376 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256 |
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