參數(shù)資料
型號: EP1C6T144I7ES
廠商: Altera Corporation
英文描述: Cyclone FPGA Family Data Sheet
中文描述: 氣旋的FPGA系列數(shù)據(jù)手冊
文件頁數(shù): 54/104頁
文件大?。?/td> 763K
代理商: EP1C6T144I7ES
2–48
Preliminary
Altera Corporation
January 2007
Cyclone Device Handbook, Volume 1
A programmable delay chain on each DQS pin allows for either a 90°
phase shift (for DDR SDRAM), or a 72° phase shift (for FCRAM) which
automatically center-aligns input DQS synchronization signals within the
data window of their corresponding DQ data signals. The phase-shifted
DQS signals drive the global clock network. This global DQS signal clocks
DQ signals on internal LE registers.
These DQS delay elements combine with the PLL’s clocking and phase
shift ability to provide a complete hardware solution for interfacing to
high-speed memory.
The clock phase shift allows the PLL to clock the DQ output enable and
output paths. The designer should use the following guidelines to meet
133 MHz performance for DDR SDRAM and FCRAM interfaces:
The DQS signal must be in the middle of the DQ group it clocks
Resynchronize the incoming data to the logic array clock using
successive LE registers or FIFO buffers
LE registers must be placed in the LAB adjacent to the DQ I/O pin
column it is fed by
Figure 2–34
illustrates DDR SDRAM and FCRAM interfacing from the
I/O through the dedicated circuitry to the logic array.
EP1C6
144-pin TQFP
4
32
240-pin PQFP
4
32
256-pin FineLine BGA
4
32
EP1C12
240-pin PQFP
4
32
256-pin FineLine BGA
4
32
324-pin FineLine BGA
8
64
EP1C20
324-pin FineLine BGA
8
64
400-pin FineLine BGA
8
64
Note to
Table 2–10
:
(1)
EP1C3 devices in the 100-pin TQFP package do not have any DQ pin groups in
I/O bank 1.
Table 2–10. DQ Pin Groups (Part 2 of 2)
Device
Package
Number of
×
8 DQ
Pin Groups
Total DQ Pin
Count
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP1C6T144I7N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Cyclone I 598 LABs 98 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP1F 制造商:NEC 制造商全稱:NEC 功能描述:HIGH HEAT RESISTIVITY
EP1F-B3G1 制造商:NEC 制造商全稱:NEC 功能描述:HIGH HEAT RESISTIVITY
EP1FB3G1S 制造商:World Products 功能描述:Electromechanical Relay SPDT 25A 12VDC 225Ohm Through Hole
EP1F-B3G1T 制造商:NEC 制造商全稱:NEC 功能描述:HIGH HEAT RESISTIVITY